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PMIC - Gestión de Energía - Especializada
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Applications | Current-Supply | Voltage-Supply | OperatingTemperature | MountingType |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC33PF8200DMESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,548 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8200DFESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,945 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8200DHESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,080 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8200ESESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,565 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8200CXESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,584 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8200CXESIC POWER MANAGEMENT LS1043A NXP USA Inc. |
3,227 | - |
RFQ |
Ficha técnica |
Tray | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8200D2ESIC POWER MANAGEMENT NXP USA Inc. |
3,383 | - |
RFQ |
Ficha técnica |
Tray | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8200DEESIC POWER MANAGEMENT I.MX8QXP NXP USA Inc. |
3,235 | - |
RFQ |
Ficha técnica |
Tray | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8200DFESI.MX8QXP WITH DDR3L NXP USA Inc. |
2,025 | - |
RFQ |
Ficha técnica |
Tray | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8200DHESIC POWER MANAGEMENT I.MX8QM NXP USA Inc. |
2,418 | - |
RFQ |
Ficha técnica |
Tray | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8200ETESIC POWER MANAGEMENT I.MX8QM NXP USA Inc. |
2,017 | - |
RFQ |
Ficha técnica |
Tray | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8200DMESPOWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,833 | - |
RFQ |
Ficha técnica |
Tray | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8200DNESPOWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,110 | - |
RFQ |
Ficha técnica |
Tray | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
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|
MVR5510AMDA0ESR2IC PMIC VR5510 ASIL-D NXP USA Inc. |
2,054 | - |
RFQ |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | Automotive | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MVR5510AMDA6ESR2IC PMIC VR5510 ASIL-D NXP USA Inc. |
3,939 | - |
RFQ |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | Automotive | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MVR5510AMDAHESR2IC PMIC VR5510 ASIL-D NXP USA Inc. |
3,534 | - |
RFQ |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | Automotive | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MVR5510AMDA4ESR2IC PMIC VR5510 ASIL-D NXP USA Inc. |
3,852 | - |
RFQ |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | Automotive | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MVR5510AMDA6ESIC PMIC VR5510 ASIL-D NXP USA Inc. |
2,657 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | Automotive | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
MCZ33800EKIC ENGINE CTRL SW/DVR 54-SOIC NXP USA Inc. |
3,731 | - |
RFQ |
Ficha técnica |
Tube | - | Active | Automotive | 10mA | 5V ~ 36V | -40°C ~ 125°C | Surface Mount |
|
MC33FS6513CAESYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc. |
2,682 | - |
RFQ |
Ficha técnica |
Tray | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
