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PMIC - Gestión de Energía - Especializada
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Applications | Current-Supply | Voltage-Supply | OperatingTemperature | MountingType |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC35FS4501CAEFS4500 NXP USA Inc. |
2,277 | - |
RFQ |
Ficha técnica |
Tray | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
MC33PF8201A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR NXP USA Inc. |
2,626 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
MC33FS8530A1ESR2SYSTEM BASIS CHIP FS8500 NXP USA Inc. |
2,301 | - |
RFQ |
Tape & Reel (TR) | * | Active | - | - | - | - | - | |
|
|
MC33FS8530A4ESR2SYSTEM BASIS CHIP FS8530 NXP USA Inc. |
3,628 | - |
RFQ |
Tape & Reel (TR) | * | Active | - | - | - | - | - | |
|
|
MC33FS8530A0ESR2SYSTEM BASIS CHIP FS8500 NXP USA Inc. |
3,236 | - |
RFQ |
Tape & Reel (TR) | * | Active | - | - | - | - | - | |
|
|
MC35FS6501CAEFS6500 NXP USA Inc. |
3,297 | - |
RFQ |
Ficha técnica |
Tray | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
|
MC35FS6503NAER2FS6500 NXP USA Inc. |
2,775 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
|
MC33FS6504LAESYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
3,984 | - |
RFQ |
Ficha técnica |
Tray | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
|
MC34FS6407NAEIC SYSTEM BASIS CHIP CAN 48LQFP NXP USA Inc. |
500 | - |
RFQ |
Ficha técnica |
Bulk,Tray | - | Active | System Basis Chip | 13mA | 2.7V ~ 36V | -40°C ~ 125°C | Surface Mount |
|
|
MWCT1213VLL32BIT 256K FLASH NXP USA Inc. |
3,594 | - |
RFQ |
Tray | * | Active | - | - | - | - | - | |
|
|
MC35FS4502CAEFS4500 NXP USA Inc. |
2,018 | - |
RFQ |
Ficha técnica |
Tray | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
|
MC35FS6502CAEFS6500 NXP USA Inc. |
3,307 | - |
RFQ |
Ficha técnica |
Tray | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
|
MC33PF8100CCESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,483 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8100EPESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,494 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8100CFESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,019 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8100EQESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,615 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8100EAESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,018 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8100CHESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,243 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33FS6514LAESYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc. |
2,162 | - |
RFQ |
Ficha técnica |
Tray | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
|
MC35FS6511CAEFS6500 NXP USA Inc. |
2,081 | - |
RFQ |
Ficha técnica |
Tray | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
