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PMIC - Gestión de Energía - Especializada
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Applications | Current-Supply | Voltage-Supply | OperatingTemperature | MountingType |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC33FS6523NAESYSTEM BASIS CHIP DCDC 2.2A VCO NXP USA Inc. |
2,407 | - |
RFQ |
Ficha técnica |
Tray | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
MC33FS8430G2ESSYSTEM BASIS CHIP FS8430 NXP USA Inc. |
3,813 | - |
RFQ |
Tray | * | Active | - | - | - | - | - | |
|
|
MC33FS8430G4ESSYSTEM BASIS CHIP FS8430 NXP USA Inc. |
3,848 | - |
RFQ |
Tray | * | Active | - | - | - | - | - | |
|
|
MC34FS6407NAER2SYSTEM BASIS CHIP CAN 5V 0.7 NXP USA Inc. |
3,797 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | System Basis Chip | 13mA | 2.7V ~ 36V | -40°C ~ 125°C (TA) | Surface Mount |
|
|
MC33FS6501CAESYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
3,444 | - |
RFQ |
Ficha técnica |
Tray | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
|
MC35FS6502NAEFS6500 NXP USA Inc. |
3,826 | - |
RFQ |
Ficha técnica |
Tray | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
|
MC35FS4502CAER2FS4500 NXP USA Inc. |
2,800 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
|
MC35FS6511NAEFS6500 NXP USA Inc. |
2,520 | - |
RFQ |
Ficha técnica |
Tray | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
|
MC35FS6502CAER2FS6500 NXP USA Inc. |
2,203 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
|
MC33FS8510A2ESSYSTEM BASIS CHIP FS8500 NXP USA Inc. |
3,454 | - |
RFQ |
Tray | * | Active | - | - | - | - | - | |
|
|
MC33FS8510A3ESSYSTEM BASIS CHIP FS8510 NXP USA Inc. |
2,663 | - |
RFQ |
Tray | * | Active | - | - | - | - | - | |
|
|
MC33FS8510B6ESFS8500 NXP USA Inc. |
2,950 | - |
RFQ |
Tray | - | Active | - | - | - | - | - | |
|
|
MC33FS8510C4ESFS8510 NXP USA Inc. |
2,763 | - |
RFQ |
Tray | - | Active | - | - | - | - | - | |
|
MWCT1011BVLHRDSC 64 LQFP 64K FLASH NXP USA Inc. |
2,966 | - |
RFQ |
Tape & Reel (TR) | - | Active | Wireless Charging | - | - | - | Surface Mount | |
|
|
MWCT1011BVLHDSC 64 LQFP 64K FLASH NXP USA Inc. |
2,539 | - |
RFQ |
Tray | - | Active | Wireless Charging | - | - | - | Surface Mount | |
|
|
MC35FS6511CAER2FS6500 NXP USA Inc. |
3,797 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
MC33PF8100CDESIC POWER MANAGEMENT I.MX8QM NXP USA Inc. |
3,370 | - |
RFQ |
Ficha técnica |
Tray | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8100CEESIC POWER MANAGEMENT I.MX8QM NXP USA Inc. |
3,458 | - |
RFQ |
Ficha técnica |
Tray | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
MPF7100BVMA0ESPF7100 PMIC OTP NXP USA Inc. |
3,179 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
MC34PF8100CFEPR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,523 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
