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PMIC - Gestión de Energía - Especializada
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Applications | Current-Supply | Voltage-Supply | OperatingTemperature | MountingType |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC34PF8100A0EPR2POWER MANAGEMENT IC I.MX8 NON-PR NXP USA Inc. |
2,077 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC34PF8100F3EPR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,815 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
MC34PF8100CHEPR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,846 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC34PF8100EPEPR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,782 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC34PF8100EREPR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,375 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC34PF8100EQEPR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,529 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
MC34FS6408NAER2SYSTEM BASIS CHIP CAN 5V 1.5 NXP USA Inc. |
2,520 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | System Basis Chip | 13mA | 2.7V ~ 36V | -40°C ~ 125°C (TA) | Surface Mount |
|
MC33FS8510D3ESFS8510 NXP USA Inc. |
3,012 | - |
RFQ |
Tray | - | Active | Automotive, Power Supplies | - | 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MC33FS6513CAER2SYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc. |
3,498 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
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|
MVR5510AMMA4ESIC PMIC VR5510 NXP USA Inc. |
2,458 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | Automotive | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MVR5510AMMAHESIC PMIC VR5510 QM NXP USA Inc. |
3,351 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | Automotive | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MVR5510AMMA6ESIC PMIC VR5510 QM NXP USA Inc. |
2,264 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | Automotive | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MC35FS4503NAER2FS4500 NXP USA Inc. |
3,266 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
|
MC33PF8200CLESR2PF8200 NXP USA Inc. |
3,538 | - |
RFQ |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | |
|
|
MC35FS6512NAEFS6500 NXP USA Inc. |
3,891 | - |
RFQ |
Ficha técnica |
Tray | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
|
MVR5510AMBA4ESR2IC PMIC VR5510 ASIL-B NXP USA Inc. |
2,842 | - |
RFQ |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | Automotive | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MVR5510AMBAHESR2IC PMIC VR5510 ASIL-B NXP USA Inc. |
2,539 | - |
RFQ |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | Automotive | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MVR5510AMBA0ESR2IC PMIC VR5510 ASIL-B NXP USA Inc. |
2,167 | - |
RFQ |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | Automotive | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MVR5510AMBA6ESR2IC PMIC VR5510 ASIL-B NXP USA Inc. |
3,217 | - |
RFQ |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | Automotive | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MC35FS6512CAER2FS6500 NXP USA Inc. |
3,586 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
- 1500+ Promedio diario de RFQ
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