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PMIC - Gestión de Energía - Especializada
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Applications | Current-Supply | Voltage-Supply | OperatingTemperature | MountingType |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MVR5510AVMA0EPR2IC PMIC VR5510 QM NXP USA Inc. |
2,537 | - |
RFQ |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | Automotive | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MVR5510AVMA4EPR2IC PMIC VR5510 QM NXP USA Inc. |
3,114 | - |
RFQ |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | Automotive | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MVR5510AVMAHEPR2IC PMIC VR5510 QM NXP USA Inc. |
3,959 | - |
RFQ |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | Automotive | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
MC35FS4500CAEFS4500 NXP USA Inc. |
2,451 | - |
RFQ |
Ficha técnica |
Tray | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
|
MC33FS6522CAER2SYSTEM BASIS CHIP DCDC 2.2A VCO NXP USA Inc. |
2,378 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
MC33PF8200DBESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,536 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8200EMESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,546 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8200ETESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,122 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8200A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR NXP USA Inc. |
3,974 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8200DNESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,502 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33FS6522LAER2SYSTEM BASIS CHIP DCDC 2.2A VCO NXP USA Inc. |
3,589 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
|
MC33FS6523NAER2SYSTEM BASIS CHIP DCDC 2.2A VCO NXP USA Inc. |
3,437 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
MPF7100BMBA0ESPF7100 PMIC OTP NXP USA Inc. |
2,421 | - |
RFQ |
Tray | - | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
MC33FS8430G1ESR2SYSTEM BASIS CHIP FS8430 NXP USA Inc. |
3,794 | - |
RFQ |
Tape & Reel (TR) | * | Active | - | - | - | - | - | |
|
|
MC33FS8430G2ESR2SYSTEM BASIS CHIP FS8430 NXP USA Inc. |
3,705 | - |
RFQ |
Tape & Reel (TR) | * | Active | - | - | - | - | - | |
|
|
MC33FS8430G0ESR2SYSTEM BASIS CHIP FS8430 NXP USA Inc. |
3,142 | - |
RFQ |
Tape & Reel (TR) | * | Active | - | - | - | - | Surface Mount, Wettable Flank | |
|
|
MC33FS8430G4ESR2SYSTEM BASIS CHIP FS8430 NXP USA Inc. |
2,597 | - |
RFQ |
Tape & Reel (TR) | * | Active | - | - | - | - | - | |
|
|
MC33FS6511CAESYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc. |
3,558 | - |
RFQ |
Ficha técnica |
Tray | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
|
MC33FS4503NAESYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
3,998 | - |
RFQ |
Ficha técnica |
Tray | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
|
MC35FS6502NAER2FS6500 NXP USA Inc. |
3,318 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
