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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TS391AXTHERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
2,887 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture |
|
TS391LTTHERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
3,165 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture |
|
SMDSWLF.008 50GLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
2,723 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008 (0.20mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 32 AWG, 35 SWG | - | Lead Free | Spool, 1.76 oz (50g) | - | - |
|
SMDSWLT.040 50GSN42/BI57/AG1 2.2 FLUX CORE SOLD Chip Quik Inc. |
3,735 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | - | Lead Free | Spool, 1.8 oz (50g) | - | - |
|
SMD291AX500T3CSOLDER PASTE NO-CLEAN 63/37 T3 5 Chip Quik Inc. |
3,459 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
NC191AX250T5SMOOTH FLOW LEADED SOLDER PASTE Chip Quik Inc. |
2,928 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
SMDLTLFP250T4SOLDER PASTE LOW TEMP T4 250G Chip Quik Inc. |
2,486 | - |
RFQ |
Ficha técnica |
Jar | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
SMD291AX250T3SOLDER PASTE SN63/PB37 250G Chip Quik Inc. |
3,028 | - |
RFQ |
Ficha técnica |
Jar | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
SMD2185SOLDER SPHERES SN63/PB37 .018 ( Chip Quik Inc. |
3,499 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.018 (0.46mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
RASWLF.031 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
3,647 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
SMDSWLT.040 100GSN42/BI57/AG1 2.2 FLUX CORE SOLD Chip Quik Inc. |
3,814 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | - | Lead Free | Spool, 3.5 oz (100g) | - | - |
|
SMD2024SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
3,311 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.012 (0.31mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMDLTLFP250T5SOLDER PASTE SN42/BI57.6/AG0.4 L Chip Quik Inc. |
2,069 | - |
RFQ |
Ficha técnica |
Jar | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
SMD3SWLT.040 200GSN42/BI58 2.2% FLUX CORE SOLDER Chip Quik Inc. |
3,249 | - |
RFQ |
Ficha técnica |
Bulk | SMD3 | Active | Wire Solder | Bi58Sn42 (58/42) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 7 oz (200g) | - | - |
|
SMD2SWLT.040 200GSN42/BI57.6/AG0.4 2.2% FLUX CORE Chip Quik Inc. |
3,128 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 7 oz (200g) | - | - |
|
NC2SWLF.031 0.5OZLF SOLDER WIRE MINI POCKET PACK Chip Quik Inc. |
2,208 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031 (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 21 SWG | - | - | Tube, 0.50 oz (14.17g) | - | - |
|
NC2SWLF.020 0.3OZLF SOLDER WIRE MINI POCKET PACK Chip Quik Inc. |
3,831 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.020 (0.51mm) | 441°F (227°C) | No-Clean | 24 AWG, 25 SWG | - | - | Tube, 0.3 oz (8.51g) | - | - |
|
NCSW.020 0.3OZSOLDER WIRE MINI POCKET PACK 63/ Chip Quik Inc. |
2,680 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Tube, 0.3 oz (8.51g) | - | - |
|
NC4SW.020 0.3OZSOLDER WIRE MINI POCKET PACK 93. Chip Quik Inc. |
2,060 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.020 (0.51mm) | 565 ~ 574°F (296 ~ 301°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Tube, 0.3 oz (8.51g) | - | - |
|
NCSWLF.020 0.3OZLF SOLDER WIRE MINI POCKET PACK Chip Quik Inc. |
3,080 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | 24 AWG, 25 SWG | - | - | Tube, 0.3 oz (8.51g) | - | - |
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