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Zócalos para circuitos integrados, transistores

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
508-AG11D-ES CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors	2,520	-	RFQ	Ficha técnica	Tube	500	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester
1825575-2 CONN IC DIP SOCKET 8POS TIN TE Connectivity AMP Connectors	2,380	-	RFQ	Ficha técnica	Tape & Reel (TR),Bulk	-	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Thermoplastic, Polyester
808-AG11D CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors	3,258	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	80.0µin (2.03µm)	Copper Alloy	Polyester
2-1814640-0 CONN IC DIP SOCKET 16POS TIN TE Connectivity AMP Connectors	3,370	-	RFQ	Ficha técnica	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester
4-1571552-9 CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors	3,362	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
828-AG12D-ES-LF CONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors	2,368	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole, Right Angle, Vertical	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
828-AG11D-ES CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors	3,343	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester
5-1571552-2 CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors	2,475	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester
824-AG11D CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors	2,466	-	RFQ	Ficha técnica	Tube	800	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester
1825088-3 CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors	3,916	-	RFQ	Ficha técnica	Tube	500	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	-	-	Brass	Thermoplastic
824-AG30D CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors	2,585	-	RFQ	Ficha técnica	Tube	800	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	-	Polyester
528-AG11D CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors	3,752	-	RFQ	Ficha técnica	Tube	500	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester
540-AG10D-ES CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors	3,829	-	RFQ	Ficha técnica	Tube	500	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	-	-	Brass	-
8080-1G16-LF CONN TRANSIST TO-3 3POS SILVER TE Connectivity AMP Connectors	3,963	-	RFQ	Ficha técnica	Bulk	8080	Active	Transistor, TO-3	3 (Oval)	-	Silver	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Silver	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)
5-6437504-0 CONN TRANSIST TO-3 3POS SILVER TE Connectivity AMP Connectors	2,589	-	RFQ		Bulk,Box	8080	Active	Transistor, TO-3	3 (Oval)	-	Silver	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Silver	-	Beryllium Copper	Diallyl Phthalate (DAP)
8080-1G45 CONN TRANSIST TO-3 3POS TIN TE Connectivity AMP Connectors	3,661	-	RFQ		Bulk	8060	Active	Transistor, TO-3	3 (Oval)	-	Tin	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)
8080-1G14 CONN SOCKET TRANSIST TO-3 3POS TE Connectivity AMP Connectors	2,408	-	RFQ	Ficha técnica	Bulk	8080	Active	Transistor, TO-3	3 (Oval)	-	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Tin-Lead	-	Beryllium Copper	Phenolic
8080-1G17 CONN TRANSIST TO-3 3POS TIN TE Connectivity AMP Connectors	2,158	-	RFQ	Ficha técnica	Bulk	8060	Active	Transistor, TO-3	3 (Oval)	-	Tin	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)
8080-1G31 CONN TRANSIST TO-3 3POS TIN TE Connectivity AMP Connectors	2,860	-	RFQ	Ficha técnica	Bulk	8060	Active	Transistor, TO-3	3 (Oval)	-	Tin	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)
9-1437504-1 CONN TRANSIST TO-3 3POS GOLD TE Connectivity AMP Connectors	3,262	-	RFQ	Ficha técnica	Bulk	8080	Active	Transistor, TO-3	3 (Oval)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polytetrafluoroethylene (PTFE)