Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
516-AG11D

516-AG11D

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
315 -

RFQ

516-AG11D

Ficha técnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
816-AG10D-ES

816-AG10D-ES

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
909 -

RFQ

816-AG10D-ES

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Copper Alloy Polyester
824-AG30D-ES

824-AG30D-ES

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
760 -

RFQ

824-AG30D-ES

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
524-AG10D-ES

524-AG10D-ES

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
213 -

RFQ

524-AG10D-ES

Ficha técnica

Tube 500 Obsolete DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass -
540-AG11D-ES

540-AG11D-ES

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
226 -

RFQ

540-AG11D-ES

Ficha técnica

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
8058-1G23

8058-1G23

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors
1,171 -

RFQ

8058-1G23

Ficha técnica

Bulk 8058 Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE)
8060-1G3

8060-1G3

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors
995 -

RFQ

8060-1G3

Ficha técnica

Bulk 8060 Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE)
8058-1G24

8058-1G24

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors
749 -

RFQ

8058-1G24

Ficha técnica

Bulk 8058 Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Panel Mount - Solder Cup - Gold - Brass Polytetrafluoroethylene (PTFE)
2041549-1

2041549-1

SOCKET ASSY, DMD 350, T/R, G/F

TE Connectivity AMP Connectors
658 -

RFQ

Tape & Reel (TR),Cut Tape (CT) DMD Active PGA, ZIF (ZIP) 350 (35 x 36) 0.050 (1.27mm) Gold Flash Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin-Lead - Copper Alloy Liquid Crystal Polymer (LCP), Glass Filled
8060-1G12

8060-1G12

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors
1,104 -

RFQ

8060-1G12

Ficha técnica

Bulk 8060 Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Fluoropolymer (FP)
8060-1G11

8060-1G11

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors
3,869 -

RFQ

8060-1G11

Ficha técnica

Bulk 8060 Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE)
2350616-1

2350616-1

DUAL LGA,250 POS, DMD SOCKET

TE Connectivity AMP Connectors
451 -

RFQ

2350616-1

Ficha técnica

Tray - Active LGA 250 (16 x 25) 0.039 (1.00mm) Gold 3.00µin (0.076µm) Copper Alloy Surface Mount Board Guide, Open Frame Solder - - - - Thermoplastic
8059-2G9

8059-2G9

CONN TRANSIST TO-5 10POS GOLD

TE Connectivity AMP Connectors
1,052 -

RFQ

8059-2G9

Ficha técnica

Bulk 8059 Obsolete Transistor, TO-5 10 (Round) - Gold - Copper Alloy Through Hole - Solder - Gold - Copper Alloy Polyamide (PA), Nylon, Glass Filled
8060-1G5

8060-1G5

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors
184 -

RFQ

8060-1G5

Ficha técnica

Bulk 8060 Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE)
8058-1G49

8058-1G49

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors
130 -

RFQ

8058-1G49

Ficha técnica

Bulk 8058 Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE)
2174988-2

2174988-2

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors
163 -

RFQ

2174988-2

Ficha técnica

Bulk - Last Time Buy LGA 2011 (47 x 58) 0.040 (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.035 (0.90mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
1-1814655-5

1-1814655-5

CONN SOCKET SIP 20POS GOLD

TE Connectivity AMP Connectors
4,978 -

RFQ

1-1814655-5

Ficha técnica

Bulk - Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester
816-AG12D-ES-LF

816-AG12D-ES-LF

CONN IC DIP SOCKET 16POS TIN

TE Connectivity AMP Connectors
187 -

RFQ

816-AG12D-ES-LF

Ficha técnica

Tube 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1814655-5

1814655-5

CONN SOCKET SIP 10POS GOLD

TE Connectivity AMP Connectors
194 -

RFQ

1814655-5

Ficha técnica

Bulk - Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 29.5µin (0.75µm) Brass Thermoplastic, Polyester
8080-1G7

8080-1G7

CONN TRANSIST TO-3 4POS GOLD

TE Connectivity AMP Connectors
2,839 -

RFQ

8080-1G7

Ficha técnica

Bulk 8080 Active Transistor, TO-3 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Fluoropolymer (FP)
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1500+
1500+ Promedio diario de RFQ
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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