Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
8059-2G1

8059-2G1

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors
2,297 -

RFQ

8059-2G1

Ficha técnica

Bulk 8059 Obsolete Transistor, TO-5 3 (Round) - Gold - Copper Alloy Through Hole - Solder - Gold - Copper Alloy Polyamide (PA), Nylon
836-AG11D

836-AG11D

CONN IC DIP SOCKET 36POS GOLD

TE Connectivity AMP Connectors
2,402 -

RFQ

836-AG11D

Ficha técnica

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
1-2324271-8

1-2324271-8

LEFT SEGMEN LGA4189-5 SOCKET-P5

TE Connectivity AMP Connectors
2,459 -

RFQ

1-2324271-8

Ficha técnica

Tray - Active LGA 4189 2092 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
1-2324271-7

1-2324271-7

RIGHT SEGMEN LGA4189-5 SOCKET-P5

TE Connectivity AMP Connectors
3,944 -

RFQ

1-2324271-7

Ficha técnica

Tray - Active LGA 4189 2092 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
2-2129710-8

2-2129710-8

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors
2,490 -

RFQ

2-2129710-8

Ficha técnica

Tray - Active LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic
2-2822979-4

2-2822979-4

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors
2,410 -

RFQ

2-2822979-4

Ficha técnica

Tray - Active LGA 3647 0.039 (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
1571552-2

1571552-2

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors
413 -

RFQ

1571552-2

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1571586-2

1571586-2

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors
909 -

RFQ

1571586-2

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1571552-6

1571552-6

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors
573 -

RFQ

1571552-6

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
820-AG11D-ESL-LF

820-AG11D-ESL-LF

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
298 -

RFQ

820-AG11D-ESL-LF

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
506-AG10D

506-AG10D

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors
2,953 -

RFQ

506-AG10D

Ficha técnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Brass -
848-AG10D

848-AG10D

CONN IC DIP SOCKET 48POS GOLD

TE Connectivity AMP Connectors
2,842 -

RFQ

848-AG10D

Ficha técnica

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - Copper Alloy Polyester
8058-1G30

8058-1G30

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors
2,773 -

RFQ

8058-1G30

Ficha técnica

Bulk 8058 Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Panel Mount Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE)
2201838-2

2201838-2

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors
2,640 -

RFQ

2201838-2

Ficha técnica

Bulk - Last Time Buy LGA 2011 (47 x 58) 0.040 (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.035 (0.90mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
8080-1G24

8080-1G24

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors
3,749 -

RFQ

8080-1G24

Ficha técnica

Bulk - Active Transistor, TO-3 3 (Round) - Tin-Lead 20.0µin (0.51µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin-Lead 20.0µin (0.51µm) Beryllium Copper Diallyl Phthalate (DAP)
840-AG11D-ESL-LF

840-AG11D-ESL-LF

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
2,913 -

RFQ

840-AG11D-ESL-LF

Ficha técnica

Tube 800 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1571994-2

1571994-2

CONN SOCKET SIP 2POS GOLD

TE Connectivity AMP Connectors
2,291 -

RFQ

1571994-2

Ficha técnica

Bulk 510 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester
1814655-7

1814655-7

CONN SOCKET SIP 10POS GOLD

TE Connectivity AMP Connectors
2,651 -

RFQ

1814655-7

Ficha técnica

Bulk - Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester
506-AG11D-ESL

506-AG11D-ESL

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors
2,988 -

RFQ

506-AG11D-ESL

Ficha técnica

Tube 500 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Copper Alloy Polyester
832-AG11D-ESL

832-AG11D-ESL

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors
3,162 -

RFQ

832-AG11D-ESL

Ficha técnica

Tube 800 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
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1500+ Promedio diario de RFQ
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1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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