Más categorías de productos

Zócalos para circuitos integrados, transistores

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
8059-2G1 CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors	2,297	-	RFQ	Ficha técnica	Bulk	8059	Obsolete	Transistor, TO-5	3 (Round)	-	Gold	-	Copper Alloy	Through Hole	-	Solder	-	Gold	-	Copper Alloy	Polyamide (PA), Nylon
836-AG11D CONN IC DIP SOCKET 36POS GOLD TE Connectivity AMP Connectors	2,402	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	-	Polyester
1-2324271-8 LEFT SEGMEN LGA4189-5 SOCKET-P5 TE Connectivity AMP Connectors	2,459	-	RFQ	Ficha técnica	Tray	-	Active	LGA 4189	2092	0.039 (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.034 (0.86mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Thermoplastic
1-2324271-7 RIGHT SEGMEN LGA4189-5 SOCKET-P5 TE Connectivity AMP Connectors	3,944	-	RFQ	Ficha técnica	Tray	-	Active	LGA 4189	2092	0.039 (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.034 (0.86mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Thermoplastic
2-2129710-8 CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors	2,490	-	RFQ	Ficha técnica	Tray	-	Active	LGA	3647	-	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	-	-	Copper Alloy	Thermoplastic
2-2822979-4 CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors	2,410	-	RFQ	Ficha técnica	Tray	-	Active	LGA	3647	0.039 (1.00mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.034 (0.86mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Thermoplastic
1571552-2 CONN IC DIP SOCKET 8POS TIN TE Connectivity AMP Connectors	413	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1571586-2 CONN IC DIP SOCKET 8POS TIN TE Connectivity AMP Connectors	909	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1571552-6 CONN IC DIP SOCKET 20POS TIN TE Connectivity AMP Connectors	573	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
820-AG11D-ESL-LF CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors	298	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
506-AG10D CONN IC DIP SOCKET 6POS GOLD TE Connectivity AMP Connectors	2,953	-	RFQ	Ficha técnica	Tube	500	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	25.0µin (0.63µm)	Brass	-
848-AG10D CONN IC DIP SOCKET 48POS GOLD TE Connectivity AMP Connectors	2,842	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	Copper Alloy	Polyester
8058-1G30 CONN TRANSIST TO-5 4POS GOLD TE Connectivity AMP Connectors	2,773	-	RFQ	Ficha técnica	Bulk	8058	Obsolete	Transistor, TO-5	4 (Round)	-	Gold	-	Beryllium Copper	Panel Mount	Closed Frame	Solder	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)
2201838-2 CONN SOCKET LGA 2011POS GOLD TE Connectivity AMP Connectors	2,640	-	RFQ	Ficha técnica	Bulk	-	Last Time Buy	LGA	2011 (47 x 58)	0.040 (1.02mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.035 (0.90mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Thermoplastic
8080-1G24 CONN SOCKET TRANSIST TO-3 3POS TE Connectivity AMP Connectors	3,749	-	RFQ	Ficha técnica	Bulk	-	Active	Transistor, TO-3	3 (Round)	-	Tin-Lead	20.0µin (0.51µm)	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin-Lead	20.0µin (0.51µm)	Beryllium Copper	Diallyl Phthalate (DAP)
840-AG11D-ESL-LF CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors	2,913	-	RFQ	Ficha técnica	Tube	800	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1571994-2 CONN SOCKET SIP 2POS GOLD TE Connectivity AMP Connectors	2,291	-	RFQ	Ficha técnica	Bulk	510	Active	SIP	2 (1 x 2)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	20.0µin (0.51µm)	Copper	Thermoplastic, Polyester
1814655-7 CONN SOCKET SIP 10POS GOLD TE Connectivity AMP Connectors	2,651	-	RFQ	Ficha técnica	Bulk	-	Active	SIP	10 (1 x 10)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Thermoplastic, Polyester
506-AG11D-ESL CONN IC DIP SOCKET 6POS GOLD TE Connectivity AMP Connectors	2,988	-	RFQ	Ficha técnica	Tube	500	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	-	Copper Alloy	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	-	Copper Alloy	Polyester
832-AG11D-ESL CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors	3,162	-	RFQ	Ficha técnica	Tube	800	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	5.00µin (0.127µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester