Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
516-AG12D-ES

516-AG12D-ES

CONN IC DIP SOCKET 16POS TINLEAD

TE Connectivity AMP Connectors
2,001 -

RFQ

516-AG12D-ES

Ficha técnica

Bulk 500 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin-Lead - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Beryllium Copper Polyester
518-AG11D-ES

518-AG11D-ES

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors
2,695 -

RFQ

518-AG11D-ES

Ficha técnica

Bulk 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 25.0µin (0.63µm) Beryllium Copper Polyester
520-AG11D-ESL

520-AG11D-ESL

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
3,474 -

RFQ

520-AG11D-ESL

Ficha técnica

Bulk 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
522-AG11D

522-AG11D

CONN IC DIP SOCKET 22POS GOLD

TE Connectivity AMP Connectors
3,284 -

RFQ

Bulk 500 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 25.0µin (0.63µm) Brass, Copper Polyester
524-AG12D

524-AG12D

CONN IC DIP SOCKET 24POS TINLEAD

TE Connectivity AMP Connectors
3,998 -

RFQ

524-AG12D

Ficha técnica

Bulk 500 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin-Lead - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Brass, Copper Polyester
528-AG11D-ESL

528-AG11D-ESL

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
2,138 -

RFQ

528-AG11D-ESL

Ficha técnica

Bulk 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 5.00µin (0.127µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 5.00µin (0.127µm) Brass, Copper Polyester
528-AG12D

528-AG12D

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors
2,695 -

RFQ

528-AG12D

Ficha técnica

Bulk 500 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Polyester
5-6437504-3

5-6437504-3

CONN TRANSIST

TE Connectivity AMP Connectors
3,063 -

RFQ

Bulk - Active - - - - - - - - - - - - - -
5-6437504-6

5-6437504-6

CONN TRANSIST

TE Connectivity AMP Connectors
3,231 -

RFQ

Bulk - Obsolete - - - - - - - - - - - - - -
5-6437508-0

5-6437508-0

CONN SOCKET TRANSIST TO-5

TE Connectivity AMP Connectors
2,966 -

RFQ

Bulk - Active Transistor, TO-5 - - - - - - Closed Frame - - - - - -
5-6437508-1

5-6437508-1

CONN SOCKET TRANSIST TO-5

TE Connectivity AMP Connectors
3,135 -

RFQ

Bulk,Bulk - Active Transistor, TO-5 - - - - - - - - - - - - -
608-AG22

608-AG22

ADAPTER PLUG ASSY

TE Connectivity AMP Connectors
2,777 -

RFQ

Bulk - Active - - - - - - - - - - - - - -
608-CG1T

608-CG1T

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
2,480 -

RFQ

608-CG1T

Ficha técnica

Bulk 600 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Phosphor Bronze Thermoplastic, Polyester
6437540-6

6437540-6

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors
2,071 -

RFQ

6437540-6

Ficha técnica

Bulk 800 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester
6437540-7

6437540-7

CONN IC DIP SOCKET 7POS GOLD

TE Connectivity AMP Connectors
2,914 -

RFQ

6437540-7

Ficha técnica

Bulk 800 Active DIP, 0.75 (19.05mm) Row Spacing 7 (1 x 7) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester
8059-2G10

8059-2G10

CONN SOCKET TRANSIST TO-5 10POS

TE Connectivity AMP Connectors
2,359 -

RFQ

8059-2G10

Ficha técnica

Bulk - Obsolete Transistor, TO-5 10 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Tin-Lead - Brass Polyamide (PA), Nylon
8059-2G3

8059-2G3

CONN SOCKET TRANSIST TO-5 4POS

TE Connectivity AMP Connectors
3,050 -

RFQ

Bulk 8059 Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polyamide (PA), Nylon, Glass Filled
8059-2G5

8059-2G5

CONN SOCKET TRANSIST TO-5 8POS

TE Connectivity AMP Connectors
2,174 -

RFQ

8059-2G5

Ficha técnica

Bulk - Obsolete Transistor, TO-5 8 (Round) - Gold - Copper Alloy Through Hole Closed Frame Solder - Gold - Copper Alloy Polyamide (PA), Nylon
8059-2G6

8059-2G6

CONN SOCKET TRANSIST TO-5 8POS

TE Connectivity AMP Connectors
3,722 -

RFQ

8059-2G6

Ficha técnica

Bulk - Obsolete Transistor, TO-5 8 (Round) - Gold - Copper Alloy Through Hole Closed Frame Solder - Tin - Copper Alloy Polyamide (PA), Nylon
8059-2G7

8059-2G7

CONN SOCKET TRANSIST TO-5 8POS

TE Connectivity AMP Connectors
2,087 -

RFQ

Bulk - Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polyamide (PA), Nylon, Glass Filled
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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