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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3-1571586-3CONN IC DIP SOCKET 42POS GOLD TE Connectivity AMP Connectors |
2,086 | - |
RFQ |
Ficha técnica |
Tube,Tube | 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper Alloy | Polyester |
|
6-1437532-1CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
3,877 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polyester |
|
8-1437531-6CONN IC DIP SOCKET 20POS TINLEAD TE Connectivity AMP Connectors |
3,130 | - |
RFQ |
Ficha técnica |
Tube | 500 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | - |
|
532-AG11D-ESCONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
2,017 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - |
|
828-AG12DCONN IC DIP SOCKET 28POS TINLEAD TE Connectivity AMP Connectors |
2,694 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
8080-1G16CONN SOCKET TRANSIST TO-3 3POS TE Connectivity AMP Connectors |
3,350 | - |
RFQ |
Ficha técnica |
Bulk | 8080 | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Silver | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Silver | - | Beryllium Copper | Diallyl Phthalate (DAP) |
|
|
8080-1G2CONN SOCKET TRANSIST TO-3 3POS TE Connectivity AMP Connectors |
3,166 | - |
RFQ |
Ficha técnica |
Bulk | - | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Silver | 500.0µin (12.70µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Silver | - | Beryllium Copper | Diallyl Phthalate (DAP) |
|
|
8080-1G3CONN SOCKET TRANSIST TO-3 3POS TE Connectivity AMP Connectors |
3,777 | - |
RFQ |
Ficha técnica |
Bulk | - | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin-Lead | - | Beryllium Copper | Phenolic |
|
|
8080-1G35CONN SOCKET TRANSIST TO-3 3POS TE Connectivity AMP Connectors |
3,387 | - |
RFQ |
Ficha técnica |
Bulk | - | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin-Lead | 20.0µin (0.51µm) | Beryllium Copper | Diallyl Phthalate (DAP) |
|
|
510-AG92D-10CONN SOCKET SIP 10POS TIN-LEAD TE Connectivity AMP Connectors |
2,195 | - |
RFQ |
Bulk | - | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin-Lead | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin-Lead | - | Beryllium Copper | Thermoplastic | |
|
2-382712-1CONN IC DIP SOCKET 16POS TIN TE Connectivity AMP Connectors |
3,453 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-382714-1CONN IC DIP SOCKET 20POS TIN TE Connectivity AMP Connectors |
2,681 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-382719-1CONN IC DIP SOCKET 30POS TIN TE Connectivity AMP Connectors |
3,046 | - |
RFQ |
Ficha técnica |
Tube,Box | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
1939416-1CONN SOCKET LGA 1207POS GOLD TE Connectivity AMP Connectors |
3,187 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA | 1207 (33 x 34) | 0.043 (1.09mm) | Gold | - | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.043 (1.09mm) | - | - | - | Thermoplastic |
|
|
1939416-2CONN SOCKET LGA 1207POS GOLD TE Connectivity AMP Connectors |
2,799 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA | 1207 (33 x 34) | 0.043 (1.09mm) | Gold | - | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.043 (1.09mm) | - | - | - | Thermoplastic |
|
|
524-AG11DCONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
2,433 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | Polyester |
|
|
814-AG11DCONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
3,769 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester |
|
814-AG11D-ESCONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
3,545 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester |
|
|
818-AG11D-ESLCONN IC DIP SOCKET 18POS GOLD TE Connectivity AMP Connectors |
2,420 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester |
|
2174988-1CONN SOCKET LGA 2011POS GOLD TE Connectivity AMP Connectors |
2,061 | - |
RFQ |
Ficha técnica |
Bulk | - | Last Time Buy | LGA | 2011 (47 x 58) | 0.040 (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.035 (0.90mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
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