Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
4-1437537-1

4-1437537-1

CONN SOCKET SIP 11POS

TE Connectivity AMP Connectors
3,965 -

RFQ

Bulk,Bulk - Active SIP 11 (1 x 11) - - - - - - - - - - - -
8-1437531-4

8-1437531-4

520-AG11F=SOCKET ASSY

TE Connectivity AMP Connectors
2,531 -

RFQ

8-1437531-4

Ficha técnica

Bulk 500 Active - - - - - - - - - - - - - -
1-6437531-1

1-6437531-1

512-22426-LF=LED SOCKET ASSY

TE Connectivity AMP Connectors
2,758 -

RFQ

Bulk - Active - - - - - - - - - - - - - -
1-1437531-1

1-1437531-1

512-22426=LED SOCKET ASSY

TE Connectivity AMP Connectors
2,198 -

RFQ

Bulk - Active - - - - - - - - - - - - - -
1-1981837-2

1-1981837-2

CONN SOCKET LGA 1366POS GOLD

TE Connectivity AMP Connectors
2,718 -

RFQ

1-1981837-2

Ficha técnica

Tray,Box - Active LGA 1366 (32 x 41) 0.040 (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.040 (1.01mm) - - - Thermoplastic
1-1571995-2

1-1571995-2

CONN SOCKET SIP 12POS GOLD

TE Connectivity AMP Connectors
2,994 -

RFQ

1-1571995-2

Ficha técnica

Bulk,Box - Obsolete SIP 12 (1 x 12) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester
347843-5

347843-5

CONN IC DIP SOCKET 10POS TINLEAD

TE Connectivity AMP Connectors
2,818 -

RFQ

Bulk - Obsolete DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin-Lead - Beryllium Copper Through Hole, Right Angle, Horizontal - Solder 0.100 (2.54mm) Tin-Lead - Beryllium Copper -
1825532-4

1825532-4

CONN SOCKET SIP 10POS GOLD

TE Connectivity AMP Connectors
3,107 -

RFQ

1825532-4

Ficha técnica

- - Obsolete SIP 10 (1 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin Flash Beryllium Copper Polyester
3-1437535-2

3-1437535-2

CONN SOCKET SIP 7POS GOLD

TE Connectivity AMP Connectors
3,082 -

RFQ

Bulk - Obsolete SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 10.0µin (0.25µm) Brass Thermoplastic
2069965-3

2069965-3

CONN SOCKET LGA 1155POS GOLD

TE Connectivity AMP Connectors
2,087 -

RFQ

2069965-3

Ficha técnica

Bulk,Box LGH Active LGA 1155 (40 x 40) 0.036 (0.91mm) Gold Flash Copper Alloy Surface Mount Open Frame Solder 0.039 (1.00mm) - - - Thermoplastic
4-2013620-3

4-2013620-3

CONN SOCKET PGA ZIF 989POS GOLD

TE Connectivity AMP Connectors
3,191 -

RFQ

4-2013620-3

Ficha técnica

Tape & Reel (TR) - Active PGA, ZIF (ZIP) 989 (35 x 36) 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039 (1.00mm) Tin-Lead 15.0µin (0.38µm) Copper Alloy Thermoplastic
4-2174003-3

4-2174003-3

CONN SOCKET PGA ZIF 989POS GOLD

TE Connectivity AMP Connectors
3,695 -

RFQ

4-2174003-3

Ficha técnica

Tape & Reel (TR) SKT Active PGA, ZIF (ZIP) 989 (35 x 36) 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039 (1.00mm) Tin-Lead - Copper Alloy Thermoplastic
1-2013620-1

1-2013620-1

CONN SOCKET PGA ZIF 989POS GOLD

TE Connectivity AMP Connectors
2,900 -

RFQ

1-2013620-1

Ficha técnica

Tape & Reel (TR) - Active PGA, ZIF (ZIP) 989 (35 x 36) 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039 (1.00mm) Tin-Lead 15.0µin (0.38µm) Copper Alloy Thermoplastic
9-6437529-4

9-6437529-4

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
3,416 -

RFQ

9-6437529-4

Ficha técnica

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Thermoplastic, Polyester
210931-1

210931-1

CONN SOCKET SIP GOLD

TE Connectivity AMP Connectors
2,379 -

RFQ

210931-1

Ficha técnica

Tape & Reel (TR) - Active SIP - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Thermoplastic, Polyester, Glass Filled
7-1437535-0

7-1437535-0

CONN SOCKET SIP 14POS GOLD

TE Connectivity AMP Connectors
3,647 -

RFQ

Bulk - Obsolete SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 10.0µin (0.25µm) Beryllium Copper Polyester
7-1437535-2

7-1437535-2

CONN SOCKET SIP 16POS GOLD

TE Connectivity AMP Connectors
3,097 -

RFQ

Bulk - Obsolete SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 10.0µin (0.25µm) Brass Thermoplastic
2134397-1

2134397-1

CONN SOCKET LGA 115POS

TE Connectivity AMP Connectors
2,544 -

RFQ

2134397-1

Ficha técnica

Bulk LGH Active LGA 115 - - - - Surface Mount Open Frame Solder - - - - Polycarbonate Film
4-1814655-7

4-1814655-7

CONN SOCKET SIP 5POS GOLD

TE Connectivity AMP Connectors
3,428 -

RFQ

4-1814655-7

Ficha técnica

Bulk - Obsolete SIP 5 (1 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester
2108142-1

2108142-1

CONN CAMERA SOCKET 24POS

TE Connectivity AMP Connectors
3,510 -

RFQ

Tape & Reel (TR) CS Active - 24 (2 x 12) - - - - Surface Mount Open Frame Solder - - - - -
Total 955 Record«Prev1... 434445464748Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario

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