Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
2-1571550-4

2-1571550-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
2,003 -

RFQ

2-1571550-4

Ficha técnica

Tube,Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2-1571550-5

2-1571550-5

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors
3,775 -

RFQ

2-1571550-5

Ficha técnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2-1571550-6

2-1571550-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
2,868 -

RFQ

2-1571550-6

Ficha técnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1825088-4

1825088-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
3,015 -

RFQ

1825088-4

Ficha técnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) - - Brass Thermoplastic
808-AG10D

808-AG10D

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
2,471 -

RFQ

808-AG10D

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Polyester
816-AG10D

816-AG10D

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
3,309 -

RFQ

816-AG10D

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
818-AG10D

818-AG10D

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors
3,130 -

RFQ

818-AG10D

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
820-AG10D

820-AG10D

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
3,727 -

RFQ

820-AG10D

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
840-AG10D

840-AG10D

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
3,242 -

RFQ

840-AG10D

Ficha técnica

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
2-1571551-8

2-1571551-8

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
3,031 -

RFQ

2-1571551-8

Ficha técnica

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
4-1571551-3

4-1571551-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors
3,426 -

RFQ

4-1571551-3

Ficha técnica

Tube,Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
4-1571551-5

4-1571551-5

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors
2,040 -

RFQ

4-1571551-5

Ficha técnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2-1571586-5

2-1571586-5

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors
3,920 -

RFQ

2-1571586-5

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
3-1571586-6

3-1571586-6

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
3,479 -

RFQ

3-1571586-6

Ficha técnica

Bulk,Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
5-1437535-4

5-1437535-4

CONN SOCKET SIP 20POS GOLD

TE Connectivity AMP Connectors
3,636 -

RFQ

Tube,Box 500 Obsolete SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper -
1825374-3

1825374-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors
3,741 -

RFQ

1825374-3

Ficha técnica

Tube Diplomate DL Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825374-4

1825374-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
3,799 -

RFQ

1825374-4

Ficha técnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
643642-6

643642-6

CONN SOCKET SIP 10POS TIN

TE Connectivity AMP Connectors
3,770 -

RFQ

643642-6

Ficha técnica

Box Diplomate DL Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
822475-3

822475-3

CONN SOCKET PLCC 32POS TIN

TE Connectivity AMP Connectors
3,454 -

RFQ

822475-3

Ficha técnica

Tube - Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS)
1571539-1

1571539-1

CONN SOCKET PLCC 20POS TIN

TE Connectivity AMP Connectors
3,958 -

RFQ

1571539-1

Ficha técnica

Bulk - Obsolete PLCC 20 (4 x 5) 0.100 (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Polyphenylene Sulfide (PPS), Glass Filled
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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