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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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2-1437531-0CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
3,326 | - |
RFQ |
Ficha técnica |
Tube,Box | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Copper Alloy | - |
|
|
2-1571586-4CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
3,892 | - |
RFQ |
Ficha técnica |
Bulk,Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
2-382462-3CONN IC DIP SOCKET 8POS TIN TE Connectivity AMP Connectors |
3,481 | - |
RFQ |
Ficha técnica |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic |
|
840-AG11DCONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
3,731 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
818-AG11D-ESCONN IC DIP SOCKET 18POS GOLD TE Connectivity AMP Connectors |
2,212 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
4-1571551-6CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
3,864 | - |
RFQ |
Ficha técnica |
Tube,Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
514-AG11D-ESCONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
2,686 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Copper Alloy | Polyester |
|
|
9-1437535-4CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
3,839 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | - |
|
820-AG11DCONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
3,137 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
|
643653-1CONN SOCKET SIP 21POS TIN TE Connectivity AMP Connectors |
2,166 | - |
RFQ |
Box | Diplomate DL | Obsolete | SIP | 21 (1 x 21) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | |
|
643662-3CONN SOCKET SIP 30POS TIN TE Connectivity AMP Connectors |
3,418 | - |
RFQ |
Ficha técnica |
Box | Diplomate DL | Obsolete | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
824-AG31DCONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
2,594 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
828-AG11D-ESLCONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
2,713 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
|
9-1437539-4CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
3,787 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 80.0µin (2.03µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
|
1-1571552-0CONN IC DIP SOCKET 32POS TIN TE Connectivity AMP Connectors |
2,858 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
808-AG11D-ES-LFCONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
2,875 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
828-AG10DCONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
3,803 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
2-1437539-9CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
2,387 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
|
5-1437539-3CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
2,530 | - |
RFQ |
Ficha técnica |
Tube,Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
|
7-1437539-0CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
3,486 | - |
RFQ |
Ficha técnica |
Tube,Tube | 800 | Obsolete | DIP, 0.5 to 0.6 Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
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