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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1-822473-1CONN SOCKET PLCC 20POS TIN TE Connectivity AMP Connectors |
3,432 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | PLCC | 20 (4 x 5) | 0.050 (1.27mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Thermoplastic |
|
|
1-382568-6CONN IC DIP SOCKET 16POS TIN TE Connectivity AMP Connectors |
2,738 | - |
RFQ |
Ficha técnica |
Box | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-382568-5CONN IC DIP SOCKET 24POS TIN TE Connectivity AMP Connectors |
3,338 | - |
RFQ |
Ficha técnica |
Box | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-382713-1CONN IC DIP SOCKET 18POS TIN TE Connectivity AMP Connectors |
2,476 | - |
RFQ |
Ficha técnica |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
2-382713-3CONN IC DIP SOCKET 18POS TIN TE Connectivity AMP Connectors |
2,364 | - |
RFQ |
Ficha técnica |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-382713-6CONN IC DIP SOCKET 18POS TIN TE Connectivity AMP Connectors |
2,396 | - |
RFQ |
Ficha técnica |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
2-382713-8CONN IC DIP SOCKET 18POS TIN TE Connectivity AMP Connectors |
2,885 | - |
RFQ |
Ficha técnica |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-382718-3CONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors |
3,236 | - |
RFQ |
Ficha técnica |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-382718-8CONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors |
3,528 | - |
RFQ |
Ficha técnica |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-382724-1CONN IC DIP SOCKET 40POS TIN TE Connectivity AMP Connectors |
3,932 | - |
RFQ |
Ficha técnica |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
2-382724-3CONN IC DIP SOCKET 40POS TIN TE Connectivity AMP Connectors |
3,076 | - |
RFQ |
Ficha técnica |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-382724-6CONN IC DIP SOCKET 40POS TIN TE Connectivity AMP Connectors |
3,584 | - |
RFQ |
Ficha técnica |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
2-382882-1CONN IC DIP SOCKET 6POS TIN TE Connectivity AMP Connectors |
2,693 | - |
RFQ |
Ficha técnica |
Box | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
641855-1CONN IC DIP SOCKET 24POS TIN TE Connectivity AMP Connectors |
2,713 | - |
RFQ |
Ficha técnica |
Box | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic |
|
|
5-1437529-9CONN IC DIP SOCKET 4POS GOLD TE Connectivity AMP Connectors |
3,484 | - |
RFQ |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Thermoplastic, Polyester | |
|
522-AG10DCONN IC DIP SOCKET 22POS GOLD TE Connectivity AMP Connectors |
3,282 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Copper Alloy | - |
|
|
7-1437532-6CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
3,959 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polyester |
|
|
1-1437536-4CONN IC DIP SOCKET 18POS GOLD TE Connectivity AMP Connectors |
3,948 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Beryllium Copper | - |
|
|
7-1437536-1CONN IC DIP SOCKET 36POS GOLD TE Connectivity AMP Connectors |
3,863 | - |
RFQ |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - | |
|
|
824-AG10DCONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
3,473 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
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