Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
08-2513-11

08-2513-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
3,300 -

RFQ

08-2513-11

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
09-0513-10H

09-0513-10H

CONN SOCKET SIP 9POS GOLD

Aries Electronics
3,307 -

RFQ

09-0513-10H

Ficha técnica

Bulk 0513 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-0518-10H

15-0518-10H

CONN SOCKET SIP 15POS GOLD

Aries Electronics
2,635 -

RFQ

15-0518-10H

Ficha técnica

Bulk 518 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-0518-10T

16-0518-10T

CONN SOCKET SIP 16POS GOLD

Aries Electronics
3,252 -

RFQ

16-0518-10T

Ficha técnica

Bulk 518 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-1518-10

18-1518-10

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
2,358 -

RFQ

18-1518-10

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-3513-00

08-3513-00

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
3,385 -

RFQ

08-3513-00

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0513-11

10-0513-11

CONN SOCKET SIP 10POS GOLD

Aries Electronics
2,940 -

RFQ

10-0513-11

Ficha técnica

Bulk 0513 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-0513-10T

14-0513-10T

CONN SOCKET SIP 14POS GOLD

Aries Electronics
2,548 -

RFQ

14-0513-10T

Ficha técnica

Bulk 0513 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0518-11H

07-0518-11H

CONN SOCKET SIP 7POS GOLD

Aries Electronics
3,918 -

RFQ

07-0518-11H

Ficha técnica

Bulk 518 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-0518-10

18-0518-10

CONN SOCKET SIP 18POS GOLD

Aries Electronics
3,947 -

RFQ

18-0518-10

Ficha técnica

Bulk 518 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3511-10WR

14-3511-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics
3,979 -

RFQ

14-3511-10WR

Ficha técnica

Bulk 511 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-4513-11

08-4513-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
2,054 -

RFQ

08-4513-11

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0518-00

10-0518-00

CONN SOCKET SIP 10POS GOLD

Aries Electronics
2,335 -

RFQ

10-0518-00

Ficha técnica

Bulk 518 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-1518-00

10-1518-00

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics
3,511 -

RFQ

10-1518-00

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0518-11

13-0518-11

CONN SOCKET SIP 13POS GOLD

Aries Electronics
2,553 -

RFQ

13-0518-11

Ficha técnica

Bulk 518 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-0518-10H

16-0518-10H

CONN SOCKET SIP 16POS GOLD

Aries Electronics
2,229 -

RFQ

16-0518-10H

Ficha técnica

Bulk 518 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-1518-10H

16-1518-10H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
3,486 -

RFQ

16-1518-10H

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
19-0518-10

19-0518-10

CONN SOCKET SIP 19POS GOLD

Aries Electronics
2,745 -

RFQ

19-0518-10

Ficha técnica

Bulk 518 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-4513-10

12-4513-10

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics
3,853 -

RFQ

12-4513-10

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0513-11H

07-0513-11H

CONN SOCKET SIP 7POS GOLD

Aries Electronics
2,226 -

RFQ

07-0513-11H

Ficha técnica

Bulk 0513 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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1500+
1500+ Promedio diario de RFQ
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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