Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
13-0518-10

13-0518-10

CONN SOCKET SIP 13POS GOLD

Aries Electronics
3,484 -

RFQ

13-0518-10

Ficha técnica

Bulk 518 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-2513-10T

10-2513-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics
3,994 -

RFQ

10-2513-10T

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-3513-10T

10-3513-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics
2,593 -

RFQ

10-3513-10T

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
09-0518-11

09-0518-11

CONN SOCKET SIP 9POS GOLD

Aries Electronics
2,986 -

RFQ

09-0518-11

Ficha técnica

Bulk 518 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-0518-10T

12-0518-10T

CONN SOCKET SIP 12POS GOLD

Aries Electronics
3,148 -

RFQ

12-0518-10T

Ficha técnica

Bulk 518 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-1518-10T

12-1518-10T

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics
2,782 -

RFQ

12-1518-10T

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0513-11H

05-0513-11H

CONN SOCKET SIP 5POS GOLD

Aries Electronics
2,007 -

RFQ

05-0513-11H

Ficha técnica

Bulk 0513 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-0513-11

06-0513-11

CONN SOCKET SIP 6POS GOLD

Aries Electronics
2,273 -

RFQ

06-0513-11

Ficha técnica

Bulk 0513 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-0518-10

14-0518-10

14 PIN SOCKET

Aries Electronics
2,405 -

RFQ

- 518 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0513-10H

07-0513-10H

CONN SOCKET SIP 7POS GOLD

Aries Electronics
2,804 -

RFQ

07-0513-10H

Ficha técnica

Bulk 0513 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-1518-10

14-1518-10

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics
2,807 -

RFQ

14-1518-10

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-6513-10

08-6513-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
2,787 -

RFQ

08-6513-10

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0513-10

10-0513-10

CONN SOCKET SIP 10POS GOLD

Aries Electronics
3,878 -

RFQ

10-0513-10

Ficha técnica

Bulk 0513 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
11-0513-10T

11-0513-10T

CONN SOCKET SIP 11POS GOLD

Aries Electronics
3,033 -

RFQ

11-0513-10T

Ficha técnica

Bulk 0513 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-3518-10H

06-3518-10H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
2,543 -

RFQ

06-3518-10H

Ficha técnica

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3518-10T

18-3518-10T

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
2,131 -

RFQ

18-3518-10T

Ficha técnica

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-0518-10H

12-0518-10H

CONN SOCKET SIP 12POS GOLD

Aries Electronics
2,505 -

RFQ

12-0518-10H

Ficha técnica

Bulk 518 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-1518-10H

12-1518-10H

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics
2,366 -

RFQ

12-1518-10H

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-3513-10T

12-3513-10T

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics
3,827 -

RFQ

12-3513-10T

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0518-00

08-0518-00

CONN SOCKET SIP 8POS GOLD

Aries Electronics
3,032 -

RFQ

08-0518-00

Ficha técnica

Bulk 518 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 4324 Record«Prev1... 1011121314151617...217Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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