Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
04-0508-20

04-0508-20

CONN SOCKET SIP 4POS GOLD

Aries Electronics
2,556 -

RFQ

04-0508-20

Ficha técnica

Bulk 508 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
04-0508-30

04-0508-30

CONN SOCKET SIP 4POS GOLD

Aries Electronics
2,933 -

RFQ

04-0508-30

Ficha técnica

Bulk 508 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
04-1508-20

04-1508-20

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics
2,998 -

RFQ

04-1508-20

Ficha técnica

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
04-1508-30

04-1508-30

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics
2,189 -

RFQ

04-1508-30

Ficha técnica

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
24-6518-10T

24-6518-10T

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,954 -

RFQ

24-6518-10T

Ficha técnica

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-3513-11

08-3513-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
3,099 -

RFQ

08-3513-11

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-3518-10M

08-3518-10M

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
3,076 -

RFQ

08-3518-10M

Ficha técnica

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-0513-10

12-0513-10

CONN SOCKET SIP 12POS GOLD

Aries Electronics
2,493 -

RFQ

12-0513-10

Ficha técnica

Bulk 0513 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
17-0518-10

17-0518-10

CONN SOCKET SIP 17POS GOLD

Aries Electronics
2,685 -

RFQ

17-0518-10

Ficha técnica

Bulk 518 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0513-10

13-0513-10

CONN SOCKET SIP 13POS GOLD

Aries Electronics
3,956 -

RFQ

13-0513-10

Ficha técnica

Bulk 0513 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0513-11

08-0513-11

CONN SOCKET SIP 8POS GOLD

Aries Electronics
2,965 -

RFQ

08-0513-11

Ficha técnica

Bulk 0513 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-2513-11

06-2513-11

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
2,197 -

RFQ

06-2513-11

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-6513-10

10-6513-10

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics
2,555 -

RFQ

10-6513-10

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-0518-11

12-0518-11

CONN SOCKET SIP 12POS GOLD

Aries Electronics
2,183 -

RFQ

12-0518-11

Ficha técnica

Bulk 518 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-1518-11

12-1518-11

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics
3,251 -

RFQ

12-1518-11

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-1518-10T

16-1518-10T

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
3,706 -

RFQ

16-1518-10T

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-3511-10

08-3511-10

CONN IC DIP SOCKET 8POS TIN

Aries Electronics
2,093 -

RFQ

08-3511-10

Ficha técnica

Bulk 511 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
17-0518-10T

17-0518-10T

CONN SOCKET SIP 17POS GOLD

Aries Electronics
2,453 -

RFQ

17-0518-10T

Ficha técnica

Bulk 518 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0517-90C

05-0517-90C

CONN SOCKET SIP 5POS GOLD

Aries Electronics
3,985 -

RFQ

05-0517-90C

Ficha técnica

Bulk 0517 Active SIP 5 (1 x 5) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-6513-11

06-6513-11

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
3,065 -

RFQ

06-6513-11

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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1500+
1500+ Promedio diario de RFQ
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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