Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
15-0513-10T

15-0513-10T

CONN SOCKET SIP 15POS GOLD

Aries Electronics
3,573 -

RFQ

15-0513-10T

Ficha técnica

Bulk 0513 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3518-00

14-3518-00

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics
3,186 -

RFQ

14-3518-00

Ficha técnica

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-1518-10T

18-1518-10T

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
2,847 -

RFQ

18-1518-10T

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3511-10

14-3511-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics
2,039 -

RFQ

14-3511-10

Ficha técnica

Bulk 511 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-0513-10H

10-0513-10H

CONN SOCKET SIP 10POS GOLD

Aries Electronics
3,940 -

RFQ

10-0513-10H

Ficha técnica

Bulk 0513 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-0513-10

14-0513-10

CONN SOCKET SIP 14POS GOLD

Aries Electronics
3,207 -

RFQ

14-0513-10

Ficha técnica

Bulk 0513 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-0518-10T

18-0518-10T

CONN SOCKET SIP 18POS GOLD

Aries Electronics
2,215 -

RFQ

18-0518-10T

Ficha técnica

Bulk 518 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-1518-10

20-1518-10

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
3,453 -

RFQ

20-1518-10

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3511-10

16-3511-10

CONN IC DIP SOCKET 16POS TIN

Aries Electronics
2,622 -

RFQ

16-3511-10

Ficha técnica

Bulk 511 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-0503-20

04-0503-20

CONN SOCKET SIP 4POS GOLD

Aries Electronics
2,600 -

RFQ

04-0503-20

Ficha técnica

Bulk 0503 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
04-0503-30

04-0503-30

CONN SOCKET SIP 4POS GOLD

Aries Electronics
2,098 -

RFQ

04-0503-30

Ficha técnica

Bulk 0503 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
20-0518-10

20-0518-10

CONN SOCKET SIP 20POS GOLD

Aries Electronics
2,689 -

RFQ

20-0518-10

Ficha técnica

Bulk 518 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0518-11H

08-0518-11H

CONN SOCKET SIP 8POS GOLD

Aries Electronics
3,154 -

RFQ

08-0518-11H

Ficha técnica

Bulk 518 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-1518-11H

08-1518-11H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
3,700 -

RFQ

08-1518-11H

Ficha técnica

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
17-0518-10H

17-0518-10H

CONN SOCKET SIP 17POS GOLD

Aries Electronics
3,039 -

RFQ

17-0518-10H

Ficha técnica

Bulk 518 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-10T

28-6518-10T

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
3,352 -

RFQ

28-6518-10T

Ficha técnica

Tube 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-6513-10

12-6513-10

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics
2,033 -

RFQ

12-6513-10

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
09-0513-11

09-0513-11

CONN SOCKET SIP 9POS GOLD

Aries Electronics
3,069 -

RFQ

09-0513-11

Ficha técnica

Bulk 0513 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-0513-10T

16-0513-10T

CONN SOCKET SIP 16POS GOLD

Aries Electronics
3,247 -

RFQ

16-0513-10T

Ficha técnica

Bulk 0513 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-0518-11

14-0518-11

CONN SOCKET SIP 14POS GOLD

Aries Electronics
3,026 -

RFQ

14-0518-11

Ficha técnica

Bulk 518 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 4324 Record«Prev1... 1516171819202122...217Next»
1500+
1500+ Promedio diario de RFQ
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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