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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
20-823-90CONN IC DIP SOCKET 20POS GOLD Aries Electronics |
1,836 | - |
RFQ |
Ficha técnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
16-2820-90CCONN IC DIP SOCKET 16POS GOLD Aries Electronics |
125 | - |
RFQ |
Ficha técnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.2 (5.08mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
18-6810-90TCONN IC DIP SOCKET 18POS TIN Aries Electronics |
104 | - |
RFQ |
Ficha técnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
8080-1G1CONN TRANSIST TO-3 4POS GOLD TE Connectivity AMP Connectors |
220 | - |
RFQ |
Ficha técnica |
Bulk | 8080 | Active | Transistor, TO-3 | 4 (Round) | - | Tin-Lead | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin-Lead | - | Beryllium Copper | Fluoropolymer (FP) |
|
110-43-308-41-105000CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp. |
1,250 | - |
RFQ |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
8080-1G15CONN TRANSIST TO-3 3POS TIN-LEAD TE Connectivity AMP Connectors |
2,589 | - |
RFQ |
Ficha técnica |
Bulk | 8080 | Active | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Fluoropolymer (FP) |
|
12-823-90CCONN IC DIP SOCKET 12POS GOLD Aries Electronics |
687 | - |
RFQ |
Ficha técnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
APA-628-G-NADAPTER PLUG Samtec Inc. |
180 | - |
RFQ |
Tube | APA | Active | - | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
2201838-1CONN SOCKET LGA 2011POS GOLD TE Connectivity AMP Connectors |
269 | - |
RFQ |
Ficha técnica |
Bulk | - | Last Time Buy | LGA | 2011 (47 x 58) | 0.040 (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035 (0.90mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
1-2324271-2LEFT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors |
2,972 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
|
1-2324271-1RIGHT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors |
114 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
D2818-42CONN IC DIP SOCKET 18POS GOLD Harwin Inc. |
2,060 | - |
RFQ |
Ficha técnica |
Tube | D2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
|
115-93-318-41-003000CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp. |
2,823 | - |
RFQ |
Ficha técnica |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
115-43-422-41-003000CONN IC DIP SOCKET 22POS GOLD Mill-Max Manufacturing Corp. |
2,296 | - |
RFQ |
Ficha técnica |
Tube | 115 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
111-43-324-41-001000CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp. |
264 | - |
RFQ |
Ficha técnica |
Tube | 111 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
214-99-632-01-670800CONN IC DIP SOCKET 32POS TINLEAD Mill-Max Manufacturing Corp. |
1,607 | - |
RFQ |
Ficha técnica |
Tube | 214 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
4516CONN TRANSIST TO-3 3POS TIN Keystone Electronics |
842 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Transistor, TO-3 | 3 (Oval) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polybutylene Terephthalate (PBT) |
|
111-93-628-41-001000CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp. |
530 | - |
RFQ |
Ficha técnica |
Tube | 111 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
111-43-632-41-001000CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp. |
186 | - |
RFQ |
Ficha técnica |
Tube | 111 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
111-93-632-41-001000CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp. |
137 | - |
RFQ |
Ficha técnica |
Tube | 111 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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