Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-823-90

20-823-90

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
1,836 -

RFQ

20-823-90

Ficha técnica

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
16-2820-90C

16-2820-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
125 -

RFQ

16-2820-90C

Ficha técnica

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-6810-90T

18-6810-90T

CONN IC DIP SOCKET 18POS TIN

Aries Electronics
104 -

RFQ

18-6810-90T

Ficha técnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
8080-1G1

8080-1G1

CONN TRANSIST TO-3 4POS GOLD

TE Connectivity AMP Connectors
220 -

RFQ

8080-1G1

Ficha técnica

Bulk 8080 Active Transistor, TO-3 4 (Round) - Tin-Lead - Beryllium Copper Through Hole Closed Frame Solder - Tin-Lead - Beryllium Copper Fluoropolymer (FP)
110-43-308-41-105000

110-43-308-41-105000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.
1,250 -

RFQ

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8080-1G15

8080-1G15

CONN TRANSIST TO-3 3POS TIN-LEAD

TE Connectivity AMP Connectors
2,589 -

RFQ

8080-1G15

Ficha técnica

Bulk 8080 Active Transistor, TO-3 3 (Oval) - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Fluoropolymer (FP)
12-823-90C

12-823-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics
687 -

RFQ

12-823-90C

Ficha técnica

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-628-G-N

APA-628-G-N

ADAPTER PLUG

Samtec Inc.
180 -

RFQ

Tube APA Active - 28 (2 x 14) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
2201838-1

2201838-1

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors
269 -

RFQ

2201838-1

Ficha técnica

Bulk - Last Time Buy LGA 2011 (47 x 58) 0.040 (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.035 (0.90mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
1-2324271-2

1-2324271-2

LEFT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors
2,972 -

RFQ

1-2324271-2

Ficha técnica

Tray - Active LGA 4189 2092 0.039 (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
1-2324271-1

1-2324271-1

RIGHT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors
114 -

RFQ

1-2324271-1

Ficha técnica

Tray - Active LGA 4189 2092 0.039 (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
D2818-42

D2818-42

CONN IC DIP SOCKET 18POS GOLD

Harwin Inc.
2,060 -

RFQ

D2818-42

Ficha técnica

Tube D2 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
115-93-318-41-003000

115-93-318-41-003000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.
2,823 -

RFQ

115-93-318-41-003000

Ficha técnica

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-422-41-003000

115-43-422-41-003000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
2,296 -

RFQ

115-43-422-41-003000

Ficha técnica

Tube 115 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-324-41-001000

111-43-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
264 -

RFQ

111-43-324-41-001000

Ficha técnica

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
214-99-632-01-670800

214-99-632-01-670800

CONN IC DIP SOCKET 32POS TINLEAD

Mill-Max Manufacturing Corp.
1,607 -

RFQ

214-99-632-01-670800

Ficha técnica

Tube 214 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
4516

4516

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics
842 -

RFQ

4516

Ficha técnica

Bulk - Active Transistor, TO-3 3 (Oval) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polybutylene Terephthalate (PBT)
111-93-628-41-001000

111-93-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
530 -

RFQ

111-93-628-41-001000

Ficha técnica

Tube 111 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-632-41-001000

111-43-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
186 -

RFQ

111-43-632-41-001000

Ficha técnica

Tube 111 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-93-632-41-001000

111-93-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
137 -

RFQ

111-93-632-41-001000

Ficha técnica

Tube 111 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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1500+ Promedio diario de RFQ
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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