Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
D2832-42

D2832-42

CONN IC DIP SOCKET 32POS GOLD

Harwin Inc.
405 -

RFQ

D2832-42

Ficha técnica

Tube D2 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
XR2A-0802

XR2A-0802

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div
247 -

RFQ

XR2A-0802

Ficha técnica

Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
111-43-628-41-001000

111-43-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
106 -

RFQ

111-43-628-41-001000

Ficha técnica

Tube 111 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-4518-10

24-4518-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,384 -

RFQ

24-4518-10

Ficha técnica

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-93-632-41-003000

115-93-632-41-003000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
197 -

RFQ

115-93-632-41-003000

Ficha técnica

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-632-41-003000

115-43-632-41-003000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
147 -

RFQ

115-43-632-41-003000

Ficha técnica

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
4514

4514

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics
1,000 -

RFQ

4514

Ficha técnica

Bulk - Active Transistor, TO-3 3 (Oval) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polybutylene Terephthalate (PBT)
540-44-020-17-400000

540-44-020-17-400000

CONN SOCKET PLCC 20POS TIN

Mill-Max Manufacturing Corp.
303 -

RFQ

540-44-020-17-400000

Ficha técnica

Tube 540 Active PLCC 20 (4 x 5) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS)
123-43-314-41-001000

123-43-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.
223 -

RFQ

123-43-314-41-001000

Ficha técnica

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
14-8400-10

14-8400-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics
118 -

RFQ

14-8400-10

Ficha técnica

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
614-43-316-31-012000

614-43-316-31-012000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.
341 -

RFQ

614-43-316-31-012000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-632-41-001000

115-93-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
480 -

RFQ

115-93-632-41-001000

Ficha técnica

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-87-310-10-001101

299-87-310-10-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,490 -

RFQ

299-87-310-10-001101

Ficha técnica

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
4592

4592

CONN TRANSIST TO-5 8POS TIN

Keystone Electronics
126 -

RFQ

4592

Ficha técnica

Bulk - Active Transistor, TO-5 8 (Round) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled
214-44-640-01-670800

214-44-640-01-670800

CONN IC DIP SOCKET 40POS TIN

Mill-Max Manufacturing Corp.
457 -

RFQ

214-44-640-01-670800

Ficha técnica

Tube 214 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
214-99-640-01-670800

214-99-640-01-670800

CONN IC DIP SOCKET 40POS TINLEAD

Mill-Max Manufacturing Corp.
183 -

RFQ

214-99-640-01-670800

Ficha técnica

Tube 214 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-47-642-41-005000

117-47-642-41-005000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.
156 -

RFQ

117-47-642-41-005000

Ficha técnica

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-318-31-012000

614-93-318-31-012000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.
113 -

RFQ

614-93-318-31-012000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
18-6513-10

18-6513-10

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
163 -

RFQ

18-6513-10

Ficha técnica

Tube Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-0518-00

16-0518-00

CONN SOCKET SIP 16POS GOLD

Aries Electronics
102 -

RFQ

16-0518-00

Ficha técnica

Bulk 518 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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1500+ Promedio diario de RFQ
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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