Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-87-652-41-001101

614-87-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,454 -

RFQ

614-87-652-41-001101

Ficha técnica

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-318-41-004101

116-83-318-41-004101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,873 -

RFQ

116-83-318-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-322-41-004101

116-87-322-41-004101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,000 -

RFQ

116-87-322-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-004101

116-87-422-41-004101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,385 -

RFQ

116-87-422-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-316-10-001101

299-83-316-10-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,922 -

RFQ

299-83-316-10-001101

Ficha técnica

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-432-41-003101

116-83-432-41-003101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,456 -

RFQ

116-83-432-41-003101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-632-41-003101

116-83-632-41-003101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,513 -

RFQ

116-83-632-41-003101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-066-11-002101

510-83-066-11-002101

CONN SOCKET PGA 66POS GOLD

Preci-Dip
3,197 -

RFQ

510-83-066-11-002101

Ficha técnica

Bulk 510 Active PGA 66 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-628-41-001101

116-87-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,448 -

RFQ

116-87-628-41-001101

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-001101

116-87-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,649 -

RFQ

116-87-328-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-001101

116-87-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,901 -

RFQ

116-87-428-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-324-41-105191

110-83-324-41-105191

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,558 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-428-41-001101

121-83-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,087 -

RFQ

121-83-428-41-001101

Ficha técnica

Bulk 121 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-328-41-008101

116-83-328-41-008101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,435 -

RFQ

116-83-328-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-100-15-001101

510-87-100-15-001101

CONN SOCKET PGA 100POS GOLD

Preci-Dip
3,946 -

RFQ

510-87-100-15-001101

Ficha técnica

Bulk 510 Active PGA 100 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-100-15-101101

510-87-100-15-101101

CONN SOCKET PGA 100POS GOLD

Preci-Dip
3,427 -

RFQ

510-87-100-15-101101

Ficha técnica

Bulk 510 Active PGA 100 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-632-41-008101

116-87-632-41-008101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,295 -

RFQ

116-87-632-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-636-31-012101

614-83-636-31-012101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
2,195 -

RFQ

614-83-636-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-648-41-005101

110-83-648-41-005101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,090 -

RFQ

110-83-648-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-101-15-101101

510-87-101-15-101101

CONN SOCKET PGA 101POS GOLD

Preci-Dip
2,357 -

RFQ

510-87-101-15-101101

Ficha técnica

Bulk 510 Active PGA 101 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1800+ Fabricantes en todo el mundo
15,000+
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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