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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
558-10-504M29-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,520 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 504 (29 x 29) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-504M29-001105CONN SOCKET PGA 504POS GOLD Preci-Dip |
3,608 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 504 (29 x 29) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
514-83-576M30-001148CONN SOCKET BGA 576POS GOLD Preci-Dip |
3,323 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 576 (30 x 30) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
518-77-500M30-001106CONN SOCKET PGA 500POS GOLD Preci-Dip |
2,755 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 500 (30 x 30) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
550-10-576M30-001152BGA SOLDER TAIL Preci-Dip |
2,660 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 576 (30 x 30) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-504M29-001106CONN SOCKET PGA 504POS GOLD Preci-Dip |
3,945 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 504 (29 x 29) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
558-10-520M31-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,260 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 520 (31 x 31) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-520M31-001105CONN SOCKET PGA 520POS GOLD Preci-Dip |
2,758 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 520 (31 x 31) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
558-10-560M33-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
3,771 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 560 (33 x 33) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
514-83-600M35-001148CONN SOCKET BGA 600POS GOLD Preci-Dip |
2,823 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 600 (35 x 35) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
518-77-520M31-001106CONN SOCKET PGA 520POS GOLD Preci-Dip |
3,632 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 520 (31 x 31) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
550-10-600M35-001152BGA SOLDER TAIL Preci-Dip |
3,957 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 600 (35 x 35) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-576M30-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
3,898 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 576 (30 x 30) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-560M33-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,140 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 560 (33 x 33) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-560M33-001105CONN SOCKET PGA 560POS GOLD Preci-Dip |
2,115 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 560 (33 x 33) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
558-10-600M35-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
3,156 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 600 (35 x 35) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-560M33-001106CONN SOCKET PGA 560POS GOLD Preci-Dip |
2,081 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 560 (33 x 33) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
514-83-652M35-001148CONN SOCKET BGA 652POS GOLD Preci-Dip |
3,465 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 652 (35 x 35) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-576M30-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,469 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 576 (30 x 30) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-576M30-001105CONN SOCKET PGA 576POS GOLD Preci-Dip |
2,951 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 576 (30 x 30) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
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