Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
518-77-456M26-001105

518-77-456M26-001105

CONN SOCKET PGA 456POS GOLD

Preci-Dip
3,998 -

RFQ

518-77-456M26-001105

Ficha técnica

Bulk 518 Active PGA 456 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
514-83-520M31-001148

514-83-520M31-001148

CONN SOCKET BGA 520POS GOLD

Preci-Dip
3,102 -

RFQ

514-83-520M31-001148

Ficha técnica

Bulk 514 Active BGA 520 (31 x 31) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-652M35-001148

514-87-652M35-001148

CONN SOCKET BGA 652POS GOLD

Preci-Dip
2,851 -

RFQ

514-87-652M35-001148

Ficha técnica

Bulk 514 Active BGA 652 (35 x 35) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-520M31-001152

550-10-520M31-001152

BGA SOLDER TAIL

Preci-Dip
2,709 -

RFQ

550-10-520M31-001152

Ficha técnica

Bulk 550 Active BGA 520 (31 x 31) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
546-83-559-22-131147

546-83-559-22-131147

CONN SOCKET PGA 559POS GOLD

Preci-Dip
3,538 -

RFQ

546-83-559-22-131147

Ficha técnica

Bulk 546 Active PGA 559 (22 x 22) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-361-18-101135

550-80-361-18-101135

PGA SOLDER TAIL

Preci-Dip
3,561 -

RFQ

550-80-361-18-101135

Ficha técnica

Bulk 550 Active PGA 361 (18 x 18) 0.050 (1.27mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
518-77-456M26-001106

518-77-456M26-001106

CONN SOCKET PGA 456POS GOLD

Preci-Dip
3,194 -

RFQ

518-77-456M26-001106

Ficha técnica

Bulk 518 Active PGA 456 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
558-10-500M30-001101

558-10-500M30-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip
2,473 -

RFQ

558-10-500M30-001101

Ficha técnica

Bulk 558 Active PGA 500 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-504M29-001101

558-10-504M29-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip
2,874 -

RFQ

558-10-504M29-001101

Ficha técnica

Bulk 558 Active PGA 504 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-478M26-131104

558-10-478M26-131104

BGA SURFACE MOUNT 1.27MM

Preci-Dip
2,948 -

RFQ

558-10-478M26-131104

Ficha técnica

Bulk 558 Active BGA 478 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-478M26-131105

518-77-478M26-131105

CONN SOCKET PGA 478POS GOLD

Preci-Dip
2,122 -

RFQ

518-77-478M26-131105

Ficha técnica

Bulk 518 Active PGA 478 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
558-10-480M29-001104

558-10-480M29-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip
3,762 -

RFQ

558-10-480M29-001104

Ficha técnica

Bulk 558 Active BGA 480 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-480M29-001105

518-77-480M29-001105

CONN SOCKET PGA 480POS GOLD

Preci-Dip
2,447 -

RFQ

518-77-480M29-001105

Ficha técnica

Bulk 518 Active PGA 480 (29 x 29) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
518-77-478M26-131106

518-77-478M26-131106

CONN SOCKET PGA 478POS GOLD

Preci-Dip
3,932 -

RFQ

518-77-478M26-131106

Ficha técnica

Bulk 518 Active PGA 478 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
558-10-520M31-001101

558-10-520M31-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip
3,430 -

RFQ

558-10-520M31-001101

Ficha técnica

Bulk 558 Active PGA 520 (31 x 31) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-480M29-001106

518-77-480M29-001106

CONN SOCKET PGA 480POS GOLD

Preci-Dip
3,353 -

RFQ

518-77-480M29-001106

Ficha técnica

Bulk 518 Active PGA 480 (29 x 29) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
514-83-560M33-001148

514-83-560M33-001148

CONN SOCKET BGA 560POS GOLD

Preci-Dip
2,318 -

RFQ

514-83-560M33-001148

Ficha técnica

Bulk 514 Active BGA 560 (33 x 33) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-560M33-001152

550-10-560M33-001152

BGA SOLDER TAIL

Preci-Dip
2,737 -

RFQ

550-10-560M33-001152

Ficha técnica

Bulk 550 Active BGA 560 (33 x 33) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-500M30-001104

558-10-500M30-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip
3,072 -

RFQ

558-10-500M30-001104

Ficha técnica

Bulk 558 Active BGA 500 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-500M30-001105

518-77-500M30-001105

CONN SOCKET PGA 500POS GOLD

Preci-Dip
3,147 -

RFQ

518-77-500M30-001105

Ficha técnica

Bulk 518 Active PGA 500 (30 x 30) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
Total 2821 Record«Prev1... 135136137138139140141142Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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