Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
550-10-576M30-001166

550-10-576M30-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
3,387 -

RFQ

550-10-576M30-001166

Ficha técnica

Bulk 550 Active BGA 576 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-356M26-001105

518-77-356M26-001105

CONN SOCKET PGA 356POS GOLD

Preci-Dip
3,923 -

RFQ

518-77-356M26-001105

Ficha técnica

Bulk 518 Active PGA 356 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
518-77-357M19-001105

518-77-357M19-001105

CONN SOCKET PGA 357POS GOLD

Preci-Dip
3,153 -

RFQ

518-77-357M19-001105

Ficha técnica

Bulk 518 Active PGA 357 (19 x 19) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
558-10-360M19-001104

558-10-360M19-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip
2,135 -

RFQ

558-10-360M19-001104

Ficha técnica

Bulk 558 Active BGA 360 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-352M26-001106

518-77-352M26-001106

CONN SOCKET PGA 352POS GOLD

Preci-Dip
3,947 -

RFQ

518-77-352M26-001106

Ficha técnica

Bulk 518 Active PGA 352 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
518-77-360M19-001105

518-77-360M19-001105

CONN SOCKET PGA 360POS GOLD

Preci-Dip
3,682 -

RFQ

518-77-360M19-001105

Ficha técnica

Bulk 518 Active PGA 360 (19 x 19) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
518-77-356M26-001106

518-77-356M26-001106

CONN SOCKET PGA 356POS GOLD

Preci-Dip
2,191 -

RFQ

518-77-356M26-001106

Ficha técnica

Bulk 518 Active PGA 356 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
518-77-357M19-001106

518-77-357M19-001106

CONN SOCKET PGA 357POS GOLD

Preci-Dip
3,275 -

RFQ

518-77-357M19-001106

Ficha técnica

Bulk 518 Active PGA 357 (19 x 19) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
558-10-388M26-001101

558-10-388M26-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip
2,296 -

RFQ

558-10-388M26-001101

Ficha técnica

Bulk 558 Active PGA 388 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
514-87-520M31-001148

514-87-520M31-001148

CONN SOCKET BGA 520POS GOLD

Preci-Dip
2,284 -

RFQ

514-87-520M31-001148

Ficha técnica

Bulk 514 Active BGA 520 (31 x 31) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
518-77-360M19-001106

518-77-360M19-001106

CONN SOCKET PGA 360POS GOLD

Preci-Dip
2,788 -

RFQ

518-77-360M19-001106

Ficha técnica

Bulk 518 Active PGA 360 (19 x 19) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
546-83-447-20-121147

546-83-447-20-121147

CONN SOCKET PGA 447POS GOLD

Preci-Dip
2,100 -

RFQ

546-83-447-20-121147

Ficha técnica

Bulk 546 Active PGA 447 (20 x 20) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-420M26-001148

514-83-420M26-001148

CONN SOCKET BGA 420POS GOLD

Preci-Dip
2,120 -

RFQ

514-83-420M26-001148

Ficha técnica

Bulk 514 Active BGA 420 (26 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-420M26-001152

550-10-420M26-001152

BGA SOLDER TAIL

Preci-Dip
2,749 -

RFQ

550-10-420M26-001152

Ficha técnica

Bulk 550 Active BGA 420 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
614-83-325-18-111144

614-83-325-18-111144

CONN SOCKET PGA 325POS GOLD

Preci-Dip
2,673 -

RFQ

614-83-325-18-111144

Ficha técnica

Bulk 614 Active PGA 325 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-400M20-000101

558-10-400M20-000101

PGA SOLDER TAIL 1.27MM

Preci-Dip
3,214 -

RFQ

558-10-400M20-000101

Ficha técnica

Bulk 558 Active PGA 400 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
514-83-432M31-001148

514-83-432M31-001148

CONN SOCKET BGA 432POS GOLD

Preci-Dip
2,449 -

RFQ

514-83-432M31-001148

Ficha técnica

Bulk 514 Active BGA 432 (31 x 31) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-320-19-131144

614-83-320-19-131144

CONN SOCKET PGA 320POS GOLD

Preci-Dip
3,729 -

RFQ

614-83-320-19-131144

Ficha técnica

Bulk 614 Active PGA 320 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-600M35-001166

550-10-600M35-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
3,299 -

RFQ

550-10-600M35-001166

Ficha técnica

Bulk 550 Active BGA 600 (35 x 35) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
614-83-321-19-121144

614-83-321-19-121144

CONN SOCKET PGA 321POS GOLD

Preci-Dip
3,306 -

RFQ

614-83-321-19-121144

Ficha técnica

Bulk 614 Active PGA 321 (21 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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