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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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550-10-381-18-101135PGA SOLDER TAIL Preci-Dip |
2,631 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | PGA | 381 (18 x 18) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-463-19-101147CONN SOCKET PGA 463POS GOLD Preci-Dip |
3,240 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 463 (19 x 19) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-432M31-001152BGA SOLDER TAIL Preci-Dip |
2,306 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 432 (31 x 31) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-388M26-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,007 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 388 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-388M26-001105CONN SOCKET PGA 388POS GOLD Preci-Dip |
3,061 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 388 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
514-87-560M33-001148CONN SOCKET BGA 560POS GOLD Preci-Dip |
3,256 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 560 (33 x 33) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-420M26-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
3,930 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 420 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-388M26-001106CONN SOCKET PGA 388POS GOLD Preci-Dip |
2,860 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 388 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
558-10-400M20-000104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,909 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 400 (20 x 20) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-400M20-000105CONN SOCKET PGA 400POS GOLD Preci-Dip |
2,052 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 400 (20 x 20) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
514-83-456M26-001148CONN SOCKET BGA 456POS GOLD Preci-Dip |
3,533 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 456 (26 x 26) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-456M26-001152BGA SOLDER TAIL Preci-Dip |
2,265 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 456 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
514-87-576M30-001148CONN SOCKET BGA 576POS GOLD Preci-Dip |
2,657 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 576 (30 x 30) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-432M31-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
2,487 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 432 (31 x 31) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-400M20-000106CONN SOCKET PGA 400POS GOLD Preci-Dip |
2,193 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 400 (20 x 20) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
550-10-652M35-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
2,170 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 652 (35 x 35) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
546-83-503-22-131147CONN SOCKET PGA 503POS GOLD Preci-Dip |
3,708 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 503 (22 x 22) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-296-19-131147CONN SOCKET PGA 296POS GOLD Preci-Dip |
2,029 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 296 (19 x 19) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-420M26-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,020 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 420 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-420M26-001105CONN SOCKET PGA 420POS GOLD Preci-Dip |
3,126 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 420 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
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