Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-160-15-061101

510-83-160-15-061101

CONN SOCKET PGA 160POS GOLD

Preci-Dip
2,499 -

RFQ

510-83-160-15-061101

Ficha técnica

Bulk 510 Active PGA 160 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-241-19-101101

510-87-241-19-101101

CONN SOCKET PGA 241POS GOLD

Preci-Dip
3,229 -

RFQ

510-87-241-19-101101

Ficha técnica

Bulk 510 Active PGA 241 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-289-17-000101

510-87-289-17-000101

CONN SOCKET PGA 289POS GOLD

Preci-Dip
2,648 -

RFQ

510-87-289-17-000101

Ficha técnica

Bulk 510 Active PGA 289 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-161-14-051101

510-83-161-14-051101

CONN SOCKET PGA 161POS GOLD

Preci-Dip
3,554 -

RFQ

510-83-161-14-051101

Ficha técnica

Bulk 510 Active PGA 161 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-243-19-081101

510-87-243-19-081101

CONN SOCKET PGA 243POS GOLD

Preci-Dip
2,831 -

RFQ

510-87-243-19-081101

Ficha técnica

Bulk 510 Active PGA 243 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-175-14-001101

510-83-175-14-001101

CONN SOCKET PGA 175POS GOLD

Preci-Dip
3,362 -

RFQ

510-83-175-14-001101

Ficha técnica

Bulk 510 Active PGA 175 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-175-15-061101

510-83-175-15-061101

CONN SOCKET PGA 175POS GOLD

Preci-Dip
2,497 -

RFQ

510-83-175-15-061101

Ficha técnica

Bulk 510 Active PGA 175 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-175-16-001101

510-83-175-16-001101

CONN SOCKET PGA 175POS GOLD

Preci-Dip
2,399 -

RFQ

510-83-175-16-001101

Ficha técnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-175-16-071101

510-83-175-16-071101

CONN SOCKET PGA 175POS GOLD

Preci-Dip
2,505 -

RFQ

510-83-175-16-071101

Ficha técnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-632-10-002101

299-87-632-10-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,328 -

RFQ

299-87-632-10-002101

Ficha técnica

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-172-16-001101

510-83-172-16-001101

CONN SOCKET PGA 172POS GOLD

Preci-Dip
3,124 -

RFQ

510-83-172-16-001101

Ficha técnica

Bulk 510 Active PGA 172 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-183-14-091111

517-87-183-14-091111

CONN SOCKET PGA 183POS GOLD

Preci-Dip
3,694 -

RFQ

517-87-183-14-091111

Ficha técnica

Bulk 517 Active PGA 183 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-174-17-061101

510-83-174-17-061101

CONN SOCKET PGA 174POS GOLD

Preci-Dip
2,216 -

RFQ

510-83-174-17-061101

Ficha técnica

Bulk 510 Active PGA 174 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-174-17-081101

510-83-174-17-081101

CONN SOCKET PGA 174POS GOLD

Preci-Dip
2,019 -

RFQ

510-83-174-17-081101

Ficha técnica

Bulk 510 Active PGA 174 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-078-13-061117

514-83-078-13-061117

CONN SOCKET PGA 78POS GOLD

Preci-Dip
3,115 -

RFQ

514-83-078-13-061117

Ficha técnica

Bulk 514 Active PGA 78 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-648-41-004101

116-87-648-41-004101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,555 -

RFQ

116-87-648-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-175-16-072101

510-83-175-16-072101

CONN SOCKET PGA 175POS GOLD

Preci-Dip
3,153 -

RFQ

510-83-175-16-072101

Ficha técnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-013101

116-87-636-41-013101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,298 -

RFQ

116-87-636-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-630-10-002101

299-83-630-10-002101

CONN IC DIP SOCKET 30POS GOLD

Preci-Dip
3,029 -

RFQ

299-83-630-10-002101

Ficha técnica

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-176-15-061101

510-83-176-15-061101

CONN SOCKET PGA 176POS GOLD

Preci-Dip
3,253 -

RFQ

510-83-176-15-061101

Ficha técnica

Bulk 510 Active PGA 176 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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