Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-176-16-001101

510-83-176-16-001101

CONN SOCKET PGA 176POS GOLD

Preci-Dip
3,179 -

RFQ

510-83-176-16-001101

Ficha técnica

Bulk 510 Active PGA 176 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-176-16-071101

510-83-176-16-071101

CONN SOCKET PGA 176POS GOLD

Preci-Dip
2,134 -

RFQ

510-83-176-16-071101

Ficha técnica

Bulk 510 Active PGA 176 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-084-10-031101

550-80-084-10-031101

PGA SOLDER TAIL

Preci-Dip
3,262 -

RFQ

550-80-084-10-031101

Ficha técnica

Bulk 550 Active PGA 84 (10 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-177-15-061101

510-83-177-15-061101

CONN SOCKET PGA 177POS GOLD

Preci-Dip
2,913 -

RFQ

510-83-177-15-061101

Ficha técnica

Bulk 510 Active PGA 177 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-640-41-004101

116-83-640-41-004101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,832 -

RFQ

116-83-640-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-179-18-001101

510-83-179-18-001101

CONN SOCKET PGA 179POS GOLD

Preci-Dip
2,149 -

RFQ

510-83-179-18-001101

Ficha técnica

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-179-18-111101

510-83-179-18-111101

CONN SOCKET PGA 179POS GOLD

Preci-Dip
2,986 -

RFQ

510-83-179-18-111101

Ficha técnica

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-179-18-112101

510-83-179-18-112101

CONN SOCKET PGA 179POS GOLD

Preci-Dip
2,482 -

RFQ

510-83-179-18-112101

Ficha técnica

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-179-18-113101

510-83-179-18-113101

CONN SOCKET PGA 179POS GOLD

Preci-Dip
3,453 -

RFQ

510-83-179-18-113101

Ficha técnica

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-168-17-001101

510-83-168-17-001101

CONN SOCKET PGA 168POS GOLD

Preci-Dip
3,789 -

RFQ

510-83-168-17-001101

Ficha técnica

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-168-17-101101

510-83-168-17-101101

CONN SOCKET PGA 168POS GOLD

Preci-Dip
3,202 -

RFQ

510-83-168-17-101101

Ficha técnica

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-168-17-102101

510-83-168-17-102101

CONN SOCKET PGA 168POS GOLD

Preci-Dip
2,644 -

RFQ

510-83-168-17-102101

Ficha técnica

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-179-15-041101

510-83-179-15-041101

CONN SOCKET PGA 179POS GOLD

Preci-Dip
2,733 -

RFQ

510-83-179-15-041101

Ficha técnica

Bulk 510 Active PGA 179 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-180-18-111101

510-83-180-18-111101

CONN SOCKET PGA 180POS GOLD

Preci-Dip
2,185 -

RFQ

510-83-180-18-111101

Ficha técnica

Bulk 510 Active PGA 180 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-068-10-061112

614-83-068-10-061112

CONN SOCKET PGA 68POS GOLD

Preci-Dip
2,728 -

RFQ

614-83-068-10-061112

Ficha técnica

Bulk 614 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-180-15-002101

510-83-180-15-002101

CONN SOCKET PGA 180POS GOLD

Preci-Dip
3,011 -

RFQ

510-83-180-15-002101

Ficha técnica

Bulk 510 Active PGA 180 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-180-15-041101

510-83-180-15-041101

CONN SOCKET PGA 180POS GOLD

Preci-Dip
3,133 -

RFQ

510-83-180-15-041101

Ficha técnica

Bulk 510 Active PGA 180 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-180-17-081101

510-83-180-17-081101

CONN SOCKET PGA 180POS GOLD

Preci-Dip
2,630 -

RFQ

510-83-180-17-081101

Ficha técnica

Bulk 510 Active PGA 180 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-180-14-031101

510-83-180-14-031101

CONN SOCKET PGA 180POS GOLD

Preci-Dip
3,168 -

RFQ

510-83-180-14-031101

Ficha técnica

Bulk 510 Active PGA 180 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-180-15-001101

510-83-180-15-001101

CONN SOCKET PGA 180POS GOLD

Preci-Dip
2,538 -

RFQ

510-83-180-15-001101

Ficha técnica

Bulk 510 Active PGA 180 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Promedio diario de RFQ
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1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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