Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-181-17-082101

510-83-181-17-082101

CONN SOCKET PGA 181POS GOLD

Preci-Dip
3,147 -

RFQ

510-83-181-17-082101

Ficha técnica

Bulk 510 Active PGA 181 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-181-14-031101

510-83-181-14-031101

CONN SOCKET PGA 181POS GOLD

Preci-Dip
3,678 -

RFQ

510-83-181-14-031101

Ficha técnica

Bulk 510 Active PGA 181 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-181-15-001101

510-83-181-15-001101

CONN SOCKET PGA 181POS GOLD

Preci-Dip
2,948 -

RFQ

510-83-181-15-001101

Ficha técnica

Bulk 510 Active PGA 181 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-181-15-051101

510-83-181-15-051101

CONN SOCKET PGA 181POS GOLD

Preci-Dip
3,708 -

RFQ

510-83-181-15-051101

Ficha técnica

Bulk 510 Active PGA 181 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-182-18-091101

510-83-182-18-091101

CONN SOCKET PGA 182POS GOLD

Preci-Dip
3,349 -

RFQ

510-83-182-18-091101

Ficha técnica

Bulk 510 Active PGA 182 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-084-10-001112

614-87-084-10-001112

CONN SOCKET PGA 84POS GOLD

Preci-Dip
3,451 -

RFQ

614-87-084-10-001112

Ficha técnica

Bulk 614 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-084-10-031112

614-87-084-10-031112

CONN SOCKET PGA 84POS GOLD

Preci-Dip
2,576 -

RFQ

614-87-084-10-031112

Ficha técnica

Bulk 614 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-650-41-004101

116-87-650-41-004101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,591 -

RFQ

116-87-650-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-181-17-001101

510-83-181-17-001101

CONN SOCKET PGA 181POS GOLD

Preci-Dip
3,695 -

RFQ

510-83-181-17-001101

Ficha técnica

Bulk 510 Active PGA 181 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-636-10-002101

299-87-636-10-002101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,434 -

RFQ

299-87-636-10-002101

Ficha técnica

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-257-19-081101

510-87-257-19-081101

CONN SOCKET PGA 257POS GOLD

Preci-Dip
2,234 -

RFQ

510-87-257-19-081101

Ficha técnica

Bulk 510 Active PGA 257 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-257-20-111101

510-87-257-20-111101

CONN SOCKET PGA 257POS GOLD

Preci-Dip
3,698 -

RFQ

510-87-257-20-111101

Ficha técnica

Bulk 510 Active PGA 257 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-184-15-001101

510-83-184-15-001101

CONN SOCKET PGA 184POS GOLD

Preci-Dip
2,889 -

RFQ

510-83-184-15-001101

Ficha técnica

Bulk 510 Active PGA 184 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-184-17-081101

510-83-184-17-081101

CONN SOCKET PGA 184POS GOLD

Preci-Dip
2,886 -

RFQ

510-83-184-17-081101

Ficha técnica

Bulk 510 Active PGA 184 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-262-20-091101

510-87-262-20-091101

CONN SOCKET PGA 262POS GOLD

Preci-Dip
3,909 -

RFQ

510-87-262-20-091101

Ficha técnica

Bulk 510 Active PGA 262 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-004101

116-83-642-41-004101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,037 -

RFQ

116-83-642-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-632-10-002101

299-83-632-10-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,172 -

RFQ

299-83-632-10-002101

Ficha técnica

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-642-41-013101

116-87-642-41-013101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,130 -

RFQ

116-87-642-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-004101

116-87-652-41-004101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,462 -

RFQ

116-87-652-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-636-41-013101

116-83-636-41-013101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
2,918 -

RFQ

116-83-636-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 107108109110111112113114...142Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario