Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-135-14-051101

510-83-135-14-051101

CONN SOCKET PGA 135POS GOLD

Preci-Dip
2,344 -

RFQ

510-83-135-14-051101

Ficha técnica

Bulk 510 Active PGA 135 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-144-12-000101

510-83-144-12-000101

CONN SOCKET PGA 144POS GOLD

Preci-Dip
3,778 -

RFQ

510-83-144-12-000101

Ficha técnica

Bulk 510 Active PGA 144 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-144-13-001101

510-83-144-13-001101

CONN SOCKET PGA 144POS GOLD

Preci-Dip
3,484 -

RFQ

510-83-144-13-001101

Ficha técnica

Bulk 510 Active PGA 144 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-144-13-041101

510-83-144-13-041101

CONN SOCKET PGA 144POS GOLD

Preci-Dip
2,085 -

RFQ

510-83-144-13-041101

Ficha técnica

Bulk 510 Active PGA 144 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-650-41-001101

116-83-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,489 -

RFQ

116-83-650-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-136-14-051101

510-83-136-14-051101

CONN SOCKET PGA 136POS GOLD

Preci-Dip
2,407 -

RFQ

510-83-136-14-051101

Ficha técnica

Bulk 510 Active PGA 136 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-648-41-002101

124-83-648-41-002101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,051 -

RFQ

Bulk 124 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-640-41-004101

116-87-640-41-004101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,123 -

RFQ

116-87-640-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-145-13-041101

510-83-145-13-041101

CONN SOCKET PGA 145POS GOLD

Preci-Dip
2,522 -

RFQ

510-83-145-13-041101

Ficha técnica

Bulk 510 Active PGA 145 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-232-17-061101

510-87-232-17-061101

CONN SOCKET PGA 232POS GOLD

Preci-Dip
3,174 -

RFQ

510-87-232-17-061101

Ficha técnica

Bulk 510 Active PGA 232 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-078-13-061117

514-87-078-13-061117

CONN SOCKET PGA 78POS GOLD

Preci-Dip
3,374 -

RFQ

514-87-078-13-061117

Ficha técnica

Bulk 514 Active PGA 78 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-233-18-071101

510-87-233-18-071101

CONN SOCKET PGA 233POS GOLD

Preci-Dip
3,609 -

RFQ

510-87-233-18-071101

Ficha técnica

Bulk 510 Active PGA 233 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-236-17-061101

510-87-236-17-061101

CONN SOCKET PGA 236POS GOLD

Preci-Dip
2,377 -

RFQ

510-87-236-17-061101

Ficha técnica

Bulk 510 Active PGA 236 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-236-17-062101

510-87-236-17-062101

CONN SOCKET PGA 236POS GOLD

Preci-Dip
3,541 -

RFQ

510-87-236-17-062101

Ficha técnica

Bulk 510 Active PGA 236 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-237-17-061101

510-87-237-17-061101

CONN SOCKET PGA 237POS GOLD

Preci-Dip
3,302 -

RFQ

510-87-237-17-061101

Ficha técnica

Bulk 510 Active PGA 237 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-652-41-001101

116-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,186 -

RFQ

116-83-652-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-142-15-081101

510-83-142-15-081101

CONN SOCKET PGA 142POS GOLD

Preci-Dip
3,431 -

RFQ

510-83-142-15-081101

Ficha técnica

Bulk 510 Active PGA 142 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-240-16-001101

510-87-240-16-001101

CONN SOCKET PGA 240POS GOLD

Preci-Dip
2,515 -

RFQ

510-87-240-16-001101

Ficha técnica

Bulk 510 Active PGA 240 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-240-17-061101

510-87-240-17-061101

CONN SOCKET PGA 240POS GOLD

Preci-Dip
2,395 -

RFQ

510-87-240-17-061101

Ficha técnica

Bulk 510 Active PGA 240 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-011101

116-83-648-41-011101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,428 -

RFQ

116-83-648-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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