Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus NumberofPositions Pitch NumberofRows RowSpacing Length-OverallPin Length-Post(Mating) Length-StackHeight Length-Tail MountingType Termination ContactFinish-Post(Mating) ContactFinishThickness-Post(Mating)
54122-113102350LF

54122-113102350LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,886 -

RFQ

54122-113102350LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 1.339 (34.000mm) 0.293 (7.450mm) 0.925 (23.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59202-F26-05P040LF

59202-F26-05P040LF

CONN HDR 10P 0.079 STACK SMD

Amphenol ICC (FCI)
3,890 -

RFQ

59202-F26-05P040LF

Ficha técnica

Tube Minitek® 2.00mm Active 10 0.079 (2.00mm) 2 0.079 (2.00mm) 0.335 (8.500mm) 0.177 (4.500mm) 0.157 (4.000mm) - Surface Mount Solder Gold 8.00µin (0.203µm)
54122-103140900LF

54122-103140900LF

CONN HDR 14POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,791 -

RFQ

54122-103140900LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 14 0.100 (2.54mm) 2 0.100 (2.54mm) 0.626 (15.900mm) 0.152 (3.850mm) 0.354 (9.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
92813-032TRLF

92813-032TRLF

CONN HDR 8POS 0.079 STACK SMD

Amphenol ICC (FCI)
3,056 -

RFQ

92813-032TRLF

Ficha técnica

Tape & Reel (TR) Minitek® Active 8 0.079 (2.00mm) 2 0.079 (2.00mm) 0.374 (9.500mm) 0.177 (4.500mm) 0.197 (5.000mm) - Surface Mount Solder Gold 30.0µin (0.76µm)
77709-727LF

77709-727LF

CONN HDR 9POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,424 -

RFQ

77709-727LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 9 0.100 (2.54mm) 1 - 0.913 (23.200mm) 0.339 (8.600mm) 0.236 (6.000mm) 0.339 (8.600mm) Through Hole Solder Gold 15.0µin (0.38µm)
59202-F34-10-105LF

59202-F34-10-105LF

CONN HDR 20P 0.079 STACK SMD

Amphenol ICC (FCI)
2,953 -

RFQ

59202-F34-10-105LF

Ficha técnica

Bag Minitek® 2.00mm Active 20 0.079 (2.00mm) 2 0.079 (2.00mm) 0.547 (13.894mm) 0.134 (3.400mm) 0.413 (10.500mm) - Surface Mount Solder Gold 8.00µin (0.203µm)
54122-106100850LF

54122-106100850LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,490 -

RFQ

54122-106100850LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 0.744 (18.900mm) 0.289 (7.341mm) 0.335 (8.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59112-F24-08U035LF

59112-F24-08U035LF

CONN HDR 16POS 0.079 STACK TH

Amphenol ICC (FCI)
2,594 -

RFQ

59112-F24-08U035LF

Ficha técnica

Bulk Minitek® 2.00mm Active 16 0.079 (2.00mm) 2 0.079 (2.00mm) 0.378 (9.600mm) 0.142 (3.600mm) 0.138 (3.500mm) 0.098 (2.500mm) Through Hole Solder Gold 8.00µin (0.203µm)
59132-T40-05-050LF

59132-T40-05-050LF

CONN HDR STACK

Amphenol ICC (FCI)
2,499 -

RFQ

Bag * Active - - - - - - - - - - - -
54112-109121350LF

54112-109121350LF

CONN HDR 12POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,714 -

RFQ

54112-109121350LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 12 0.100 (2.54mm) 2 0.100 (2.54mm) 1.025 (26.035mm) 0.399 (10.135mm) 0.531 (13.500mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54112-109121400LF

54112-109121400LF

CONN HDR 12POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,074 -

RFQ

54112-109121400LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 12 0.100 (2.54mm) 2 0.100 (2.54mm) 1.025 (26.035mm) 0.379 (9.627mm) 0.551 (14.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
20021834-10008T1LF

20021834-10008T1LF

CONN HDR 8POS 0.050 STACK SMD

Amphenol ICC (FCI)
2,308 -

RFQ

20021834-10008T1LF

Ficha técnica

Tube Minitek127® 20021834 Active 8 0.050 (1.27mm) 2 0.050 (1.27mm) 0.559 (14.200mm) 0.138 (3.500mm) 0.394 (10.000mm) - Surface Mount Solder Gold Flash
54122-108121300LF

54122-108121300LF

CONN HDR 12POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,436 -

RFQ

54122-108121300LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 12 0.100 (2.54mm) 2 0.100 (2.54mm) 0.925 (23.500mm) 0.293 (7.450mm) 0.512 (13.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-112101850LF

54122-112101850LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,258 -

RFQ

54122-112101850LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 1.325 (33.660mm) 0.477 (12.116mm) 0.728 (18.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-808121500LF

54122-808121500LF

CONN HDR 12POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,983 -

RFQ

54122-808121500LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 12 0.100 (2.54mm) 2 0.100 (2.54mm) 0.925 (23.500mm) 0.215 (5.450mm) 0.591 (15.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
10066848-106LF

10066848-106LF

CONN HDR 10POS 0.079 STACK T/H

Amphenol ICC (FCI)
3,142 -

RFQ

10066848-106LF

Ficha técnica

Tape & Reel (TR) Minitek® Active 10 0.079 (2.00mm) 2 0.079 (2.00mm) 0.531 (13.500mm) 0.169 (4.300mm) 0.264 (6.700mm) 0.098 (2.500mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54121-408141800LF

54121-408141800LF

CONN HDR 14POS 0.100 STACK TH

Amphenol ICC (FCI)
2,758 -

RFQ

54121-408141800LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 14 0.100 (2.54mm) 1 - 0.925 (23.500mm) 0.096 (2.450mm) 0.709 (18.000mm) 0.120 (3.050mm) Through Hole Solder Tin 78.7µin (2.00µm)
59202-F34-06-105LF

59202-F34-06-105LF

CONN HDR 12P 0.079 STACK SMD

Amphenol ICC (FCI)
2,366 -

RFQ

59202-F34-06-105LF

Ficha técnica

Bag Minitek® 2.00mm Active 12 0.079 (2.00mm) 2 0.079 (2.00mm) 0.547 (13.894mm) 0.134 (3.400mm) 0.413 (10.500mm) - Surface Mount Solder Gold 8.00µin (0.203µm)
20021832-05004C1LF

20021832-05004C1LF

CONN HDR STACK

Amphenol ICC (FCI)
3,557 -

RFQ

Tape & Reel (TR) * Active - - - - - - - - - - - -
59362-T32-06-072LF

59362-T32-06-072LF

CONN HDR 12POS 0.079 STACK TH

Amphenol ICC (FCI)
2,684 -

RFQ

Bag Minitek® 2.00mm Active 12 0.079 (2.00mm) 2 0.079 (2.00mm) 0.555 (14.100mm) 0.193 (4.900mm) 0.283 (7.200mm) 0.079 (2.000mm) Through Hole Solder Gold 30.0µin (0.76µm)
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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