Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus NumberofPositions Pitch NumberofRows RowSpacing Length-OverallPin Length-Post(Mating) Length-StackHeight Length-Tail MountingType Termination ContactFinish-Post(Mating) ContactFinishThickness-Post(Mating)
59202-F26-02-040LF

59202-F26-02-040LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
3,915 -

RFQ

Bag * Active - - - - - - - - - - - -
59202-T26-05A040LF

59202-T26-05A040LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
2,075 -

RFQ

Tape & Reel (TR) * Active - - - - - - - - - - - -
59202-T26-04-055LF

59202-T26-04-055LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
2,089 -

RFQ

Bag * Active - - - - - - - - - - - -
59132-G30-02-064LF

59132-G30-02-064LF

CONN HDR STACK

Amphenol ICC (FCI)
3,697 -

RFQ

Bag * Active - - - - - - - - - - - -
59112-S28-06-044LF

59112-S28-06-044LF

CONN HDR STACK

Amphenol ICC (FCI)
2,219 -

RFQ

Bag * Active - - - - - - - - - - - -
75970-358-16LF

75970-358-16LF

CONN HDR 16POS 0.100 STACK TH

Amphenol ICC (FCI)
2,002 -

RFQ

75970-358-16LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 16 0.100 (2.54mm) 1 - 1.575 (40.000mm) 0.256 (6.500mm) 1.201 (30.500mm) 0.118 (3.000mm) Through Hole Solder Tin 78.7µin (2.00µm)
54112-408161150LF

54112-408161150LF

CONN HDR 16POS 0.100 STACK TH

Amphenol ICC (FCI)
3,352 -

RFQ

54112-408161150LF

Ficha técnica

Bulk,Bag BERGSTIK®, MezzSelect™, Basics+ Active 16 0.100 (2.54mm) 2 0.100 (2.54mm) 0.925 (23.500mm) 0.377 (9.576mm) 0.453 (11.500mm) 0.095 (2.413mm) Through Hole Solder Tin 78.7µin (2.00µm)
54112-811121200LF

54112-811121200LF

CONN HDR 12POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,756 -

RFQ

54112-811121200LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 12 0.100 (2.54mm) 2 0.100 (2.54mm) 1.225 (31.115mm) 0.658 (16.713mm) 0.472 (12.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54112-811121900LF

54112-811121900LF

CONN HDR 12POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,724 -

RFQ

54112-811121900LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 12 0.100 (2.54mm) 2 0.100 (2.54mm) 1.225 (31.115mm) 0.382 (9.700mm) 0.748 (19.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
76745-106-06LF

76745-106-06LF

CONN HDR 6POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,350 -

RFQ

76745-106-06LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 6 0.100 (2.54mm) 2 0.100 (2.54mm) 0.825 (20.955mm) 0.260 (6.600mm) 0.445 (11.300mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
20021833-08506T1LF

20021833-08506T1LF

CONN HDR 6POS 0.050 STACK SMD

Amphenol ICC (FCI)
3,840 -

RFQ

20021833-08506T1LF

Ficha técnica

Tube Minitek127® 20021833 Active 6 0.050 (1.27mm) 2 0.050 (1.27mm) 0.480 (12.200mm) 0.118 (3.000mm) 0.335 (8.500mm) - Surface Mount Solder Gold Flash
54112-508121270LF

54112-508121270LF

CONN HDR STACK

Amphenol ICC (FCI)
3,468 -

RFQ

Bag * Active - - - - - - - - - - - -
54112-801160800LF

54112-801160800LF

CONN HDR 16POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,821 -

RFQ

54112-801160800LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 16 0.100 (2.54mm) 2 0.100 (2.54mm) 0.480 (12.200mm) 0.098 (2.500mm) 0.315 (8.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54122-806140850LF

54122-806140850LF

CONN HDR 14POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,699 -

RFQ

54122-806140850LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 14 0.100 (2.54mm) 2 0.100 (2.54mm) 0.744 (18.900mm) 0.289 (7.341mm) 0.335 (8.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
76745-809-12LF

76745-809-12LF

CONN HDR 12POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,057 -

RFQ

76745-809-12LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 12 0.100 (2.54mm) 2 0.100 (2.54mm) 0.525 (13.335mm) 0.225 (5.715mm) 0.200 (5.080mm) 0.100 (2.540mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
98426-G03-04-118LF

98426-G03-04-118LF

CONN HDR 8POS 0.079 STACK T/H

Amphenol ICC (FCI)
2,193 -

RFQ

98426-G03-04-118LF

Ficha técnica

Box Minitek® 2.00mm Active 8 0.079 (2.00mm) 2 0.079 (2.00mm) 0.555 (14.100mm) 0.157 (4.000mm) 0.299 (7.600mm) 0.091 (2.300mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-128121250LF

54122-128121250LF

CONN HDR STACK

Amphenol ICC (FCI)
2,739 -

RFQ

Bag * Active - - - - - - - - - - - -
20021832-04008T1LF

20021832-04008T1LF

CONN HDR 8POS 0.050 STACK SMD

Amphenol ICC (FCI)
3,942 -

RFQ

20021832-04008T1LF

Ficha técnica

Tape & Reel (TR) Minitek127® 20021832 Active 8 0.050 (1.27mm) 2 0.050 (1.27mm) 0.402 (10.200mm) 0.217 (5.500mm) 0.157 (4.000mm) - Surface Mount Solder Gold Flash
54111-111112100LF

54111-111112100LF

CONN HDR 11POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,492 -

RFQ

54111-111112100LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 11 0.100 (2.54mm) 1 - 1.225 (31.115mm) 0.304 (7.722mm) 0.827 (21.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-105060850LF

54122-105060850LF

CONN HDR 6POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,701 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 6 0.100 (2.54mm) 2 0.100 (2.54mm) 0.695 (17.650mm) 0.240 (6.100mm) 0.335 (8.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
Total 1780 Record«Prev1... 1718192021222324...89Next»
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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