Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus NumberofPositions Pitch NumberofRows RowSpacing Length-OverallPin Length-Post(Mating) Length-StackHeight Length-Tail MountingType Termination ContactFinish-Post(Mating) ContactFinishThickness-Post(Mating)
54122-811062200LF

54122-811062200LF

CONN HDR 6POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,390 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 6 0.100 (2.54mm) 2 0.100 (2.54mm) 1.225 (31.115mm) 0.239 (6.071mm) 0.866 (22.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54112-111082000LF

54112-111082000LF

CONN HDR STACK

Amphenol ICC (FCI)
3,306 -

RFQ

Bulk * Active - - - - - - - - - - - -
59202-G26-05-045LF

59202-G26-05-045LF

CONN HDR 10P 0.079 STACK SMD

Amphenol ICC (FCI)
2,257 -

RFQ

59202-G26-05-045LF

Ficha técnica

Bag Minitek® 2.00mm Active 10 0.079 (2.00mm) 2 0.079 (2.00mm) 0.335 (8.500mm) 0.157 (4.000mm) 0.177 (4.500mm) - Surface Mount Solder Gold 30.0µin (0.76µm)
54122-108100950LF

54122-108100950LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,920 -

RFQ

54122-108100950LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 0.925 (23.500mm) 0.431 (10.950mm) 0.374 (9.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54112-109101800LF

54112-109101800LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,830 -

RFQ

54112-109101800LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 1.025 (26.035mm) 0.221 (5.613mm) 0.709 (18.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54112-809101700LF

54112-809101700LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,387 -

RFQ

54112-809101700LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 1.025 (26.035mm) 0.261 (6.629mm) 0.669 (17.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54111-103100950LF

54111-103100950LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,445 -

RFQ

54111-103100950LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 1 - 0.626 (15.900mm) 0.157 (4.000mm) 0.374 (9.500mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54112-109101450LF

54112-109101450LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,065 -

RFQ

54112-109101450LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 1.025 (26.035mm) 0.359 (9.119mm) 0.571 (14.500mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-108101800LF

54122-108101800LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,991 -

RFQ

54122-108101800LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 0.925 (23.500mm) 0.096 (2.450mm) 0.709 (18.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54112-109101400LF

54112-109101400LF

CONN HDR STACK

Amphenol ICC (FCI)
2,759 -

RFQ

Bag * Active - - - - - - - - - - - -
54112-108101200LF

54112-108101200LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,002 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 0.925 (23.500mm) 0.358 (9.100mm) 0.472 (12.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59132-H34-10-089LF

59132-H34-10-089LF

CONN HDR STACK T/H

Amphenol ICC (FCI)
3,537 -

RFQ

Bag * Active - - - - - - - - - - - -
75970-323-05LF

75970-323-05LF

CONN HDR 5POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,958 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 5 0.100 (2.54mm) 1 - - - - - Through Hole Solder Tin 78.7µin (2.00µm)
54112-107121450LF

54112-107121450LF

CONN HDR 12POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,028 -

RFQ

54112-107121450LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 12 0.100 (2.54mm) 2 0.100 (2.54mm) 0.825 (20.955mm) 0.159 (4.039mm) 0.571 (14.500mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
76745-1CN-06LF

76745-1CN-06LF

CONN HDR 6POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,598 -

RFQ

76745-1CN-06LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 6 0.100 (2.54mm) 2 0.100 (2.54mm) 0.779 (19.787mm) 0.279 (7.087mm) 0.220 (5.600mm) 0.279 (7.087mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59132-T38-05-050LF

59132-T38-05-050LF

CONN HDR STACK

Amphenol ICC (FCI)
3,904 -

RFQ

Bag * Active - - - - - - - - - - - -
10121036-S03-145LF

10121036-S03-145LF

CONN HDR 6POS 0.079 STACK T/H

Amphenol ICC (FCI)
3,934 -

RFQ

10121036-S03-145LF

Ficha técnica

Bag - Active 6 0.079 (2.00mm) 2 0.079 (2.00mm) 0.831 (21.100mm) 0.130 (3.300mm) 0.571 (14.500mm) 0.130 (3.300mm) Through Hole Solder Gold 15.0µin (0.38µm)
59202-T24-02P043LF

59202-T24-02P043LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
3,558 -

RFQ

Tube * Active - - - - - - - - - - - -
59202-F36-04P134LF

59202-F36-04P134LF

CONN HDR 8POS 0.079 STACK SMD

Amphenol ICC (FCI)
3,437 -

RFQ

59202-F36-04P134LF

Ficha técnica

Tube Minitek® 2.00mm Active 8 0.079 (2.00mm) 2 0.079 (2.00mm) 0.610 (15.500mm) 0.083 (2.100mm) 0.528 (13.400mm) - Surface Mount Solder Gold 8.00µin (0.203µm)
59202-T28-05-060LF

59202-T28-05-060LF

CONN HDR 10P 0.079 STACK SMD

Amphenol ICC (FCI)
2,816 -

RFQ

59202-T28-05-060LF

Ficha técnica

Bag Minitek® 2.00mm Active 10 0.079 (2.00mm) 2 0.079 (2.00mm) 0.398 (10.100mm) 0.161 (4.100mm) 0.236 (6.000mm) - Surface Mount Solder Gold 30.0µin (0.76µm)
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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