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Térmico - Disipadores de calor
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
HSE06-503045HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices |
1,197 | - |
RFQ |
Ficha técnica |
Bag | HSE | Active | Board Level | Clip | Rectangular, Fins | 1.969 (50.00mm) | 1.181 (30.00mm) | - | 1.772 (45.00mm) | 12.79W @ 75°C | 2.10°C/W @ 200 LFM | 5.86°C/W | Aluminum Alloy | |
|
NTE498HEATSINK FOR PLASTIC PWR NTE Electronics, Inc |
532 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Top Mount | Bolt On | Rectangular, Fins | 1.500 (38.10mm) | 0.500 (12.70mm) | - | 1.375 (34.93mm) | - | - | 10.40°C/W | Aluminum Alloy | |
|
HSE08-505028HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices |
1,118 | - |
RFQ |
Ficha técnica |
Bag | HSE | Active | Board Level | Clip | Rectangular, Angled Fins | 1.969 (50.00mm) | 1.102 (28.00mm) | - | 1.969 (50.00mm) | 10.53W @ 75°C | 2.70°C/W @ 200 LFM | 7.13°C/W | Aluminum Alloy | |
|
V2276E1CPU HEATSINK, CROSS CUT, AL6063 Assmann WSW Components |
1,499 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | - | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.063 (27.00mm) | 1.063 (27.00mm) | - | 0.984 (25.00mm) | - | - | 19.50°C/W | ||
|
HSB27-434316HEAT SINK, BGA, 43.1 X 43.1 X 16 CUI Devices |
1,081 | - |
RFQ |
Ficha técnica |
Box | HSB | Active | Top Mount | Adhesive | Square, Pin Fins | 1.697 (43.10mm) | 1.697 (43.10mm) | - | 0.650 (16.51mm) | 8.98W @ 75°C | 2.80°C/W @ 200 LFM | 8.35°C/W | Aluminum Alloy | |
|
ATS-PCB1056HEATSINK TO-218/TO-247 ALUMINUM Advanced Thermal Solutions Inc. |
379 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | Bolt On and Board Mounts | Rectangular, Fins | 1.622 (41.20mm) | 2.010 (51.00mm) | - | 0.748 (19.00mm) | - | 2.40°C/W @ 200 LFM | 8.00°C/W | Aluminum | |
|
HSE02-173213PHEAT SINK, EXTRUSION, 17 X 31.9 CUI Devices |
1,572 | - |
RFQ |
Ficha técnica |
Box | HSE | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Angled Fins | 0.669 (17.00mm) | 0.669 (17.00mm) | - | 0.492 (12.50mm) | 3.5W @ 75°C | 6.70°C/W @ 200 LFM | 21.44°C/W | Aluminum Alloy | |
|
TGH-0510-01ALUMINIUM HEAT SINK 51X35MM t-Global Technology |
204 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Top Mount | - | Rectangular, Fins | 1.378 (35.00mm) | 2.008 (51.00mm) | - | 0.197 (5.00mm) | - | - | - | Aluminum | |
|
TGH-0280-07ALUMINIUM HEAT SINK 28X28MM t-Global Technology |
158 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Top Mount | - | Square, Fins | 1.102 (28.00mm) | 1.102 (28.00mm) | - | 0.591 (15.01mm) | - | - | - | Aluminum | |
|
NTE448BCLIP-ON H/S FOR 14/16 DIP NTE Electronics, Inc |
270 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Top Mount | Press Fit | Rectangular, Angled Fins | 0.887 (22.53mm) | 0.600 (15.24mm) | - | 0.410 (10.42mm) | - | - | 20.00°C/W | Aluminum Alloy | |
|
RPIHS-01RASPBERRY PI LOW PROF HEAT SINK OSEPP Electronics LTD |
605 | - |
RFQ |
Ficha técnica |
Retail Package | - | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Fins | - | - | - | - | - | - | - | Aluminum | |
|
XL25D-TO247-22-17-0.64CERAMIC HEAT SPREADER 22X17X0.63 t-Global Technology |
121 | - |
RFQ |
Ficha técnica |
Bulk | XL-25 | Active | Heat Spreader | - | Rectangular | 0.866 (22.00mm) | 0.669 (17.00mm) | - | 0.025 (0.64mm) | - | - | - | Ceramic | |
|
XL25D-TO220-20-14-0.64CERAMIC HEAT SPREADER 20X14X0.63 t-Global Technology |
107 | - |
RFQ |
Ficha técnica |
Bulk | XL-25 | Active | Heat Spreader | - | Rectangular | 0.787 (20.00mm) | 0.551 (14.00mm) | - | 0.025 (0.64mm) | - | - | - | Ceramic | |
|
ATS-PCB1037HEATSINK TO-220 W/TAB BLACK Advanced Thermal Solutions Inc. |
1,486 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.380 (35.05mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | - | 13.00°C/W @ 200 LFM | 18.00°C/W | Aluminum | |
|
TGH-0350-03ALUMINIUM HEAT SINK 35X35MM t-Global Technology |
107 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Top Mount | - | Square, Fins | 1.378 (35.00mm) | 1.378 (35.00mm) | - | 0.591 (15.01mm) | - | - | - | Aluminum | |
|
HSE07-753045HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices |
993 | - |
RFQ |
Ficha técnica |
Bag | HSE | Active | Board Level | Clip | Rectangular, Fins | 2.953 (75.00mm) | 1.181 (30.00mm) | - | 1.772 (45.00mm) | 15.46W @ 75°C | 2.10°C/W @ 200 LFM | 4.85°C/W | Aluminum Alloy | |
|
TGH-0260-02ALUMINIUM HEAT SINK 26X26MM t-Global Technology |
1,000 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Top Mount | - | Square, Pin Fins | 1.024 (26.00mm) | 1.024 (26.00mm) | - | 0.583 (14.80mm) | - | - | - | Aluminum | |
|
TGH-0300-03ALUMINIUM HEAT SINK 30X30MM t-Global Technology |
183 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Top Mount | - | Square, Pin Fins | 1.181 (30.00mm) | 1.181 (30.00mm) | - | 0.472 (12.00mm) | - | - | - | Aluminum | |
|
HSE09-755028HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices |
999 | - |
RFQ |
Ficha técnica |
Bag | HSE | Active | Board Level | Clip | Rectangular, Angled Fins | 2.953 (75.00mm) | 1.102 (28.00mm) | - | 1.969 (50.00mm) | 13.26W @ 75°C | 2.50°C/W @ 200 LFM | 5.66°C/W | Aluminum Alloy | |
|
V2271E1CPU HEATSINK, CROSS CUT, AL6063 Assmann WSW Components |
1,449 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | - | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.378 (35.00mm) | 1.378 (35.00mm) | - | 1.177 (29.90mm) | - | - | 12.00°C/W |
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