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Térmico - Disipadores de calor
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
HSS26-B20-P38HEAT SINK, STAMPING, TO-218/TO-2 CUI Devices |
3,000 | - |
RFQ |
Ficha técnica |
Bag | HSS | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 2.000 (50.80mm) | 1.378 (35.00mm) | - | 0.335 (8.50mm) | 4.5W @ 75°C | 9.20°C/W @ 200 LFM | 16.66°C/W | Aluminum Alloy | |
|
HSB10-232306HEAT SINK, BGA, 23 X 23 X 6 MM CUI Devices |
1,503 | - |
RFQ |
Ficha técnica |
Box | HSB | Active | Top Mount | Adhesive | Square, Pin Fins | 0.906 (23.00mm) | 0.906 (23.00mm) | - | 0.236 (6.00mm) | 3.0W @ 75°C | 9.60°C/W @ 200 LFM | 25.46°C/W | Aluminum Alloy | |
|
HSE04-251265-2HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices |
2,777 | - |
RFQ |
Ficha técnica |
Bag | HSE | Active | Top Mount | Bolt On | Rectangular, Fins | 0.984 (25.00mm) | 0.472 (12.00mm) | - | 0.256 (6.50mm) | 2.47W @ 75°C | 16.60°C/W @ 200 LFM | 30.38°C/W | Aluminum Alloy | |
|
|
HSE04-251265-1HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices |
2,793 | - |
RFQ |
Ficha técnica |
Bag | HSE | Active | Top Mount | Bolt On | Rectangular, Fins | 0.984 (25.00mm) | 0.472 (12.00mm) | - | 0.256 (6.50mm) | 2.4W @ 75°C | 16.30°C/W @ 200 LFM | 31.22°C/W | Aluminum Alloy | |
|
V2286BCPU HEATSINK, CROSS CUT, AL6063 Assmann WSW Components |
3,452 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | - | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 0.551 (14.00mm) | 0.551 (14.00mm) | - | 0.236 (6.00mm) | - | - | 32.00°C/W | ||
|
HSS09-B20-P431HEAT SINK, STAMPING, TO-220, 29. CUI Devices |
2,874 | - |
RFQ |
Ficha técnica |
Box | HSS | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular | 1.180 (29.97mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | 4.0W @ 75°C | 7.70°C/W @ 200 LFM | 18.82°C/W | Aluminum Alloy | |
|
HSS27-B20-P43HEAT SINK, STAMPING, TO-218/TO-2 CUI Devices |
2,500 | - |
RFQ |
Ficha técnica |
Bag | HSS | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.193 (30.30mm) | 0.874 (22.20mm) | - | 0.211 (5.35mm) | 3.03W @ 75°C | 13.20°C/W @ 200 LFM | 24.79°C/W | Aluminum Alloy | |
|
NTE496HEATSINK FOR PLASTIC PWR NTE Electronics, Inc |
1,312 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Board Level, Vertical | Bolt On and Board Mounts | Rectangular, Fins | 1.250 (31.75mm) | 0.875 (22.22mm) | - | 0.250 (6.35mm) | - | - | 24.00°C/W | Aluminum Alloy | |
|
V2268E1CPU HEATSINK, CROSS CUT, AL6063 Assmann WSW Components |
2,562 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | - | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 0.669 (17.00mm) | 0.669 (17.00mm) | - | 0.236 (6.00mm) | - | - | 30.00°C/W | ||
|
HSS24-B20-NPHEAT SINK, STAMPING, TO-218/TO-2 CUI Devices |
2,992 | - |
RFQ |
Ficha técnica |
Box | HSS | Active | Top Mount | Bolt On | Rectangular, Fins | 1.654 (42.00mm) | 1.496 (38.00mm) | - | 0.984 (25.00mm) | 7.85W @ 75°C | 4.30°C/W @ 200 LFM | 9.56°C/W | Aluminum Alloy | |
|
HSS11-B20-P38HEAT SINK, STAMPING, TO-220, 50. CUI Devices |
2,215 | - |
RFQ |
Ficha técnica |
Box | HSS | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular | 2.000 (50.80mm) | 1.260 (32.00mm) | - | 0.500 (12.70mm) | 4.8W @ 75°C | 6.90°C/W @ 200 LFM | 15.76°C/W | Aluminum Alloy | |
|
HSS15-B20-P40HEAT SINK, STAMPING, TO-220, 23. CUI Devices |
4,828 | - |
RFQ |
Ficha técnica |
Box | HSS | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular | 1.500 (38.10mm) | 0.921 (23.40mm) | - | 0.500 (12.70mm) | 5.0W @ 75°C | 8.50°C/W @ 200 LFM | 15.16°C/W | Aluminum Alloy | |
|
ATS-PCB1019HEATSINK TO-218/TO-202/TO-220 Advanced Thermal Solutions Inc. |
1,347 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level | Bolt On | Rectangular, Fins | 1.181 (30.00mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | - | 10.10°C/W @ 200 LFM | 22.00°C/W | Aluminum | |
|
HSB26-343408HEAT SINK, BGA, 33.5 X 33.5 X 8 CUI Devices |
1,219 | - |
RFQ |
Ficha técnica |
Box | HSB | Active | Top Mount | Adhesive | Square, Pin Fins | 1.319 (33.50mm) | 1.319 (33.50mm) | - | 0.315 (8.00mm) | 4.94W @ 75°C | 5.30°C/W @ 200 LFM | 15.19°C/W | Aluminum Alloy | |
|
NTE402HEAT SINK-PLAST. PWR TRAN NTE Electronics, Inc |
172 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Board Level | Bolt On | Rectangular, Fins | 1.180 (29.97mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | - | - | 16.70°C/W | Aluminum Alloy | |
|
HSS02-B20-P318HEAT SINK, STAMPING, TO-220, 23. CUI Devices |
1,628 | - |
RFQ |
Ficha técnica |
Box | HSS | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular | 1.900 (48.26mm) | 0.930 (23.62mm) | - | 0.950 (24.13mm) | 6.9W @ 75°C | 4.80°C/W @ 200 LFM | 10.90°C/W | Aluminum Alloy | |
|
V2277E1CPU HEATSINK, CROSS CUT, AL6063 Assmann WSW Components |
1,354 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | - | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.378 (35.00mm) | 1.378 (35.00mm) | - | 0.394 (10.00mm) | - | - | 26.00°C/W | ||
|
ATS-PCB1032HEATSINK CLIP-ON TO-220 BLK Advanced Thermal Solutions Inc. |
2,494 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level | Bolt On | Rectangular, Fins | 0.850 (21.59mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | - | 9.00°C/W @ 200 LFM | 20.00°C/W | Aluminum | |
|
HSS04-B20-P318HEAT SINK, STAMPING, TO-220, 41. CUI Devices |
1,984 | - |
RFQ |
Ficha técnica |
Box | HSS | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular | 1.650 (41.91mm) | 1.750 (44.45mm) | - | 0.380 (9.65mm) | 5.9W @ 75°C | 5.50°C/W @ 200 LFM | 12.79°C/W | Aluminum Alloy | |
|
NTE497HEATSINK FOR TO-220 NTE Electronics, Inc |
1,448 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Board Level, Vertical | Bolt On and Board Mounts | Rectangular, Fins | 0.500 (12.70mm) | 1.380 (35.05mm) | - | 2.000 (50.80mm) | - | - | 9.44°C/W | Aluminum Alloy |
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