+86 075582561136
Subir BOM
Térmico - Disipadores de calor
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
HSB25-282810HEAT SINK, BGA, 28.5 X 28.5 X 10 CUI Devices |
1,708 | - |
RFQ |
Ficha técnica |
Box | HSB | Active | Top Mount | Push Pin | Square, Pin Fins | 1.122 (28.50mm) | 1.122 (28.50mm) | - | 0.394 (10.00mm) | 4.87W @ 75°C | 5.10°C/W @ 200 LFM | 15.41°C/W | Aluminum Alloy | |
|
NTE494HEATSINK FOR TO220 NTE Electronics, Inc |
256 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Top Mount | - | Rectangular, Fins | 0.750 (19.05mm) | 0.500 (12.70mm) | - | 0.500 (12.70mm) | - | - | 27.30°C/W | Aluminum Alloy | |
|
HSE01-193175HEAT SINK, EXTRUSION, 19 X 31.5 CUI Devices |
1,580 | - |
RFQ |
Ficha técnica |
Box | HSE | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Angled Fins | 0.748 (19.00mm) | 0.748 (19.00mm) | - | 0.295 (7.50mm) | 2.95W @ 75°C | 9.20°C/W @ 200 LFM | 25.44°C/W | Aluminum Alloy | |
|
HSS07-C20-P274HEAT SINK, STAMPING, TO-220, 21. CUI Devices |
1,890 | - |
RFQ |
Ficha técnica |
Box | HSS | Active | Board Level, Vertical | PC Pin | Rectangular | 0.853 (21.66mm) | 0.520 (13.21mm) | - | 0.515 (13.08mm) | 2.5W @ 75°C | 12.60°C/W @ 200 LFM | 29.57°C/W | Copper Alloy | |
|
HSB23-232325HEAT SINK, BGA, 23 X 23 X 25 MM CUI Devices |
1,202 | - |
RFQ |
Ficha técnica |
Box | HSB | Active | Top Mount | Adhesive | Square, Pin Fins | 0.906 (23.00mm) | 0.906 (23.00mm) | - | 0.984 (25.00mm) | 6.13W @ 75°C | 3.80°C/W @ 200 LFM | 12.23°C/W | Aluminum Alloy | |
|
HSE05-171933HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices |
3,230 | - |
RFQ |
Ficha técnica |
Box | HSE | Active | Board Level | PC Pin | Rectangular, Angled Fins | 0.764 (19.40mm) | 0.669 (17.00mm) | - | 1.280 (32.50mm) | 3.98W @ 75°C | 6.90°C/W @ 200 LFM | 18.83°C/W | Aluminum Alloy | |
|
HSE02-173213HEAT SINK, EXTRUSION, 17 X 31.9 CUI Devices |
1,542 | - |
RFQ |
Ficha técnica |
Box | HSE | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Angled Fins | 0.669 (17.00mm) | 0.669 (17.00mm) | - | 0.492 (12.50mm) | 3.5W @ 75°C | 6.70°C/W @ 200 LFM | 21.44°C/W | Aluminum Alloy | |
|
ATS-PCB1043HEATSINK TO-3 Advanced Thermal Solutions Inc. |
2,416 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level | Bolt On | Rhombus | 2.507 (63.67mm) | 1.867 (47.41mm) | - | 1.667 (42.33mm) | - | 2.60°C/W @ 200 LFM | 7.50°C/W | Aluminum | |
|
ATS-PCB1021HEATSINK TO-220 DUAL BLACK Advanced Thermal Solutions Inc. |
2,323 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level | Bolt On | Rectangular, Fins | 1.470 (37.34mm) | 1.750 (44.45mm) | - | 0.380 (9.65mm) | - | 3.00°C/W @ 200 LFM | 9.60°C/W | Aluminum | |
|
NTE411HEAT SINK STUD-MOUNT TO5 NTE Electronics, Inc |
1,000 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Top Mount | - | Cylindrical | - | 0.437 (11.09mm) | 0.312 (7.92mm) ID | 0.440 (11.18mm) | - | - | - | - | |
|
ATS-PCB1033HEATSINK CLIP-ON TO-220 W/TAB Advanced Thermal Solutions Inc. |
2,269 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 0.850 (21.59mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | - | 9.00°C/W @ 200 LFM | 20.00°C/W | Aluminum | |
|
V2270E1CPU HEATSINK, CROSS CUT, AL6063 Assmann WSW Components |
1,035 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | - | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 0.827 (21.00mm) | 0.827 (21.00mm) | - | 0.590 (15.00mm) | - | - | 17.00°C/W | ||
|
V2275E1CPU HEATSINK, CROSS CUT, AL6063 Assmann WSW Components |
1,318 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | - | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.063 (27.00mm) | 1.063 (27.00mm) | - | 0.709 (18.00mm) | - | - | 23.00°C/W | ||
|
|
HSE01-193175PHEAT SINK, EXTRUSION, 19 X 31.5 CUI Devices |
1,584 | - |
RFQ |
Ficha técnica |
Box | HSE | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Angled Fins | 0.748 (19.00mm) | 0.748 (19.00mm) | - | 0.295 (7.50mm) | 2.95W @ 75°C | 9.20°C/W @ 200 LFM | 25.44°C/W | Aluminum Alloy | |
|
ATS-PCB1049HEATSINK TO-220 W/TAB BLACK Advanced Thermal Solutions Inc. |
9,501 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.670 (42.42mm) | 1.000 (25.40mm) | - | 1.000 (25.40mm) | - | 4.40°C/W @ 200 LFM | 10.00°C/W | Aluminum | |
|
NTE406HEAT SINK FOR TO-202 CASE NTE Electronics, Inc |
306 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Top Mount | Press Fit | - | 0.800 (20.32mm) | - | 0.300 (7.62mm) OD | 0.850 (21.60mm) | - | - | 25.00°C/W | Aluminum Alloy | |
|
V2278E1CPU HEATSINK, CROSS CUT, AL6063 Assmann WSW Components |
1,500 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | - | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.378 (35.00mm) | 1.378 (35.00mm) | - | 0.709 (18.00mm) | - | - | 18.00°C/W | ||
|
TGH-0200-06ALUMINIUM HEAT SINK 44X20MM t-Global Technology |
425 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Top Mount | - | Rectangular, Fins | 1.732 (44.00mm) | 0.787 (20.00mm) | - | 0.236 (6.00mm) | - | - | - | Aluminum | |
|
ATS-PCB1059HEATSINK TO-220 COPPER W/TAB Advanced Thermal Solutions Inc. |
1,224 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | Bolt On and Board Mounts | Rectangular, Fins | 1.250 (31.75mm) | 0.875 (22.22mm) | - | 0.250 (6.35mm) | - | 8.80°C/W @ 200 LFM | 24.00°C/W | Copper | |
|
HSB30-373710HEAT SINK, BGA, 37.4 X 37 X 10 M CUI Devices |
665 | - |
RFQ |
Ficha técnica |
Box | HSB | Active | - | - | - | - | - | - | - | - | - | - | - |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
