Térmico - Disipadores de calor

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
HSB02-101007

HSB02-101007

HEAT SINK, BGA, 10 X 10 X 7 MM

CUI Devices
3,512 -

RFQ

HSB02-101007

Ficha técnica

Box HSB Active Top Mount Adhesive Square, Pin Fins 0.394 (10.00mm) 0.394 (10.00mm) - 0.275 (7.00mm) 2.0W @ 75°C 16.50°C/W @ 200 LFM 37.90°C/W Aluminum Alloy
V6560X

V6560X

HEATSINK ALUM ANOD

Assmann WSW Components
7,182 -

RFQ

V6560X

Ficha técnica

Tray - Active Top Mount Bolt On and PC Pin Square, Fins 1.575 (40.00mm) 1.575 (40.00mm) - 0.472 (12.00mm) - - 8.00°C/W Aluminum
V5229W

V5229W

HEATSINK ALUM ANOD W/PIN TO-220

Assmann WSW Components
1,609 -

RFQ

V5229W

Ficha técnica

Tray - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.984 (25.00mm) 1.260 (32.00mm) - 0.551 (14.00mm) - - 12.50°C/W Aluminum
V7477X

V7477X

HEATSINK ALUM ANOD

Assmann WSW Components
1,342 -

RFQ

V7477X

Ficha técnica

Tray - Active Top Mount Bolt On and PC Pin Square, Fins 1.457 (37.00mm) 1.457 (37.00mm) - 0.500 (12.70mm) - - 11.00°C/W Aluminum
V2026B

V2026B

HEATSINK CPU XCUT

Assmann WSW Components
2,472 -

RFQ

V2026B

Ficha técnica

Bulk - Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.063 (27.00mm) 1.063 (27.00mm) - 0.236 (6.00mm) - - 20.00°C/W Aluminum Alloy
V5629G

V5629G

HEATSINK ALUM ANOD

Assmann WSW Components
1,780 -

RFQ

V5629G

Ficha técnica

Bulk - Active Board Level Bolt On Rectangular, Fins 0.984 (25.00mm) 0.472 (12.00mm) - 0.256 (6.50mm) - - 40.00°C/W Aluminum
V4330N

V4330N

HEATSINK ANOD ALUM TO-220

Assmann WSW Components
1,873 -

RFQ

V4330N

Ficha técnica

Tray - Active Top Mount Bolt On Rectangular, Fins 0.787 (20.00mm) 1.142 (29.00mm) - 0.472 (12.00mm) - - 12.00°C/W Aluminum
574502B03200G

574502B03200G

HEATSINK TO-220 CLIP-ON/TAB

Aavid, Thermal Division of Boyd Corporation
14,680 -

RFQ

574502B03200G

Ficha técnica

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 0.750 (19.05mm) 0.860 (21.84mm) - 0.395 (10.03mm) 3.0W @ 60°C 6.00°C/W @ 600 LFM 21.20°C/W Aluminum
V2019B

V2019B

HEATSINK CPU XCUT

Assmann WSW Components
6,000 -

RFQ

V2019B

Ficha técnica

Bulk - Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.472 (12.00mm) 0.472 (12.00mm) - 0.709 (18.00mm) - - 27.00°C/W Aluminum Alloy
HSB03-141406

HSB03-141406

HEAT SINK, BGA, 14 X 14 X 6 MM

CUI Devices
3,393 -

RFQ

HSB03-141406

Ficha técnica

Box HSB Active Top Mount Adhesive Square, Pin Fins 0.551 (14.00mm) 0.551 (14.00mm) - 0.236 (6.00mm) 2.1W @ 75°C 15.80°C/W @ 200 LFM 35.98°C/W Aluminum Alloy
272-AB

272-AB

HEATSINK TO-220 SM FOOTPRINT BLK

Wakefield-Vette
3,322 -

RFQ

272-AB

Ficha técnica

Bulk 272 Active Board Level Bolt On and PC Pin Rectangular, Fins 1.450 (36.83mm) 1.750 (44.45mm) - 0.375 (9.52mm) 4.0W @ 42°C 3.60°C/W @ 400 LFM 10.50°C/W Aluminum
V9582X-LP

V9582X-LP

HEATSINK SOT-32 TO-220

Assmann WSW Components
8,810 -

RFQ

V9582X-LP

Ficha técnica

Bulk - Active Board Level Bolt On and PC Pin Rectangular, Fins 1.500 (38.10mm) 0.640 (16.26mm) - 0.640 (16.26mm) - - 8.50°C/W Aluminum
6237BG

6237BG

BOARD LEVEL HEATSINK .375TO-220

Aavid, Thermal Division of Boyd Corporation
2,422 -

RFQ

6237BG

Ficha técnica

Bulk - Active Board Level Clip Rectangular, Fins 0.700 (17.78mm) 0.900 (22.86mm) - 0.375 (9.52mm) 2.0W @ 50°C 14.00°C/W @ 200 LFM 25.00°C/W Aluminum
507102B00000G

507102B00000G

HEATSINK TO-220 EXT CAP 2W

Aavid, Thermal Division of Boyd Corporation
1,757 -

RFQ

507102B00000G

Ficha técnica

Bag Hat Section 5070 Active Board Level Bolt On Rectangular, Fins 0.700 (17.78mm) 1.750 (44.45mm) - 0.500 (12.70mm) 4.0W @ 40°C 5.00°C/W @ 200 LFM 15.60°C/W Aluminum
501200B00000G

501200B00000G

HEATSINK 14-16 DIP BLACK .19

Aavid, Thermal Division of Boyd Corporation
4,077 -

RFQ

501200B00000G

Ficha técnica

Bag - Active Top Mount Thermal Tape, Adhesive (Not Included) Rectangular, Fins 0.250 (6.35mm) 0.731 (18.57mm) - 0.190 (4.83mm) 0.4W @ 30°C 50.00°C/W @ 200 LFM 68.00°C/W Aluminum
592502B03400G

592502B03400G

HEATSINK TO-220 VERT MNT W/TABS

Aavid, Thermal Division of Boyd Corporation
21,873 -

RFQ

592502B03400G

Ficha técnica

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.250 (31.75mm) 0.874 (22.20mm) - 0.250 (6.35mm) 1.0W @ 30°C 10.00°C/W @ 200 LFM 22.00°C/W Aluminum
V2027B

V2027B

HEATSINK CPU XCUT

Assmann WSW Components
4,287 -

RFQ

V2027B

Ficha técnica

Bulk - Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.098 (27.90mm) 1.098 (27.90mm) - 0.441 (11.20mm) - - 19.00°C/W Aluminum Alloy
7020BG

7020BG

HEATSINK TO-220 FOLD 42.16MM

Aavid, Thermal Division of Boyd Corporation
5,460 -

RFQ

7020BG

Ficha técnica

Bulk - Active Board Level Bolt On Rectangular, Fins 1.450 (36.83mm) 1.300 (33.02mm) - 0.470 (11.94mm) 8.0W @ 70°C 4.00°C/W @ 500 LFM 8.70°C/W Aluminum
V7477W

V7477W

HEATSINK TOP-3 TO-220 SOT-32

Assmann WSW Components
3,868 -

RFQ

V7477W

Ficha técnica

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.000 (25.40mm) 1.374 (34.90mm) - 0.500 (12.70mm) - - 14.00°C/W Aluminum
573400D00000G

573400D00000G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation
1,072 -

RFQ

573400D00000G

Ficha técnica

Bulk - Active Top Mount SMD Pad Rectangular, Fins 0.500 (12.70mm) 1.220 (30.99mm) - 0.401 (10.20mm) 1.0W @ 20°C 4.00°C/W @ 600 LFM 14.00°C/W -
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1500+ Promedio diario de RFQ
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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