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Térmico - Disipadores de calor
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ATS-PCB1025HEATSINK TO-126 BLACK Advanced Thermal Solutions Inc. |
5,770 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level | Bolt On | Rectangular, Fins | 0.560 (14.22mm) | 0.620 (15.75mm) | - | 0.370 (9.40mm) | - | 19.00°C/W @ 200 LFM | 33.00°C/W | Aluminum | |
|
V5618CHEATSINK ALUM ANOD Assmann WSW Components |
2,364 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Top Mount | Press Fit | Rectangular, Fins | 0.900 (23.00mm) | 0.250 (6.35mm) | - | 0.189 (4.80mm) | - | - | 40.00°C/W | Aluminum | |
|
591302B02800GHEATSINK TO-220 W/INSTALL TAB Aavid, Thermal Division of Boyd Corporation |
33,492 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | Clip and Board Locks | Rectangular, Fins | 0.750 (19.05mm) | 0.500 (12.70mm) | - | 0.500 (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | 26.80°C/W | Aluminum | |
|
523002B00000GHEATSINK TO-220 W/TAB BLACK Aavid, Thermal Division of Boyd Corporation |
7,690 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.180 (29.97mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | 13.60°C/W | Aluminum | |
|
V7466XHEATSINK ALUM ANOD Assmann WSW Components |
1,900 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.500 (38.10mm) | 1.772 (45.00mm) | - | 0.500 (12.70mm) | - | - | 7.00°C/W | Aluminum | |
|
HSB12-272706HEAT SINK, BGA, 27 X 27 X 6 MM CUI Devices |
1,713 | - |
RFQ |
Ficha técnica |
Box | HSB | Active | Top Mount | Adhesive | Square, Pin Fins | 1.063 (27.00mm) | 1.063 (27.00mm) | - | 0.236 (6.00mm) | 3.8W @ 75°C | 7.80°C/W @ 200 LFM | 19.59°C/W | Aluminum Alloy | |
|
HSS10-B20-P40HEAT SINK, STAMPING, TO-220, 29. CUI Devices |
2,894 | - |
RFQ |
Ficha técnica |
Box | HSS | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular | 1.180 (29.97mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | 4.1W @ 75°C | 7.90°C/W @ 200 LFM | 18.12°C/W | Aluminum Alloy | |
|
ATS-PCB1065HEATSINK TO-220 CLIP-ON BLACK Advanced Thermal Solutions Inc. |
2,237 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level | Clip | Rectangular, Fins | 0.748 (19.00mm) | 0.504 (12.80mm) | - | 0.500 (12.70mm) | - | 10.20°C/W @ 200 LFM | 27.30°C/W | Aluminum | |
|
HSB03-121218HEAT SINK, BGA, 12 X 12 X 18 MM CUI Devices |
1,743 | - |
RFQ |
Ficha técnica |
Box | HSB | Active | Top Mount | Adhesive | Square, Pin Fins | 0.472 (12.00mm) | 0.472 (12.00mm) | - | 0.709 (18.00mm) | 3.1W @ 75°C | 9.60°C/W @ 200 LFM | 24.01°C/W | Aluminum Alloy | |
|
ATS-PCB1066HEATSINK TO-220/TO-262 W/TAB Advanced Thermal Solutions Inc. |
1,530 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | Clip and PC Pin | Rectangular, Fins | 0.748 (19.00mm) | 0.504 (12.80mm) | - | 0.500 (12.70mm) | - | 10.20°C/W @ 200 LFM | 27.30°C/W | Aluminum | |
|
V5220WHEATSINK ANOD ALUM W/PIN TO-220 Assmann WSW Components |
3,366 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Board Level, Vertical | Bolt On | Rectangular, Fins | 0.984 (25.00mm) | 1.260 (32.00mm) | - | 0.787 (19.99mm) | - | - | 10.00°C/W | Aluminum | |
|
20188SILENTSTEPSTICK HEATSINK 9 X 9 X Watterott Electronic GmbH |
6,851 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.354 (9.00mm) | 0.354 (9.00mm) | - | 0.472 (12.00mm) | - | - | - | Aluminum | |
|
507222B05300GHEAT SINK Aavid, Thermal Division of Boyd Corporation |
16,126 | - |
RFQ |
Ficha técnica |
Bulk | Hat Section 5070 | Active | Board Level | Bolt On | Rectangular, Fins | 0.375 (9.53mm) | 1.750 (44.45mm) | - | 1.470 (37.34mm) | - | - | - | Aluminum | |
|
530614B00000GHEATSINK TO-220 4.5W H=.5 BLK Aavid, Thermal Division of Boyd Corporation |
5,960 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Board Level | Bolt On | Rectangular, Fins | 1.180 (29.97mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | 4.0W @ 80°C | 6.00°C/W @ 600 LFM | 16.70°C/W | Aluminum | |
|
V7700WHEATSINK ALUM ANOD Assmann WSW Components |
18,526 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Board Level, Vertical | Bolt On | Square, Pin Fins | 0.984 (25.00mm) | 0.625 (16.00mm) | - | 0.630 (16.00mm) | - | - | 24.00°C/W | Aluminum | |
|
ATS-PCB1009HEATSINK TO-220 LOW PROFILE Advanced Thermal Solutions Inc. |
2,549 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level | Bolt On | Square, Fins | 0.750 (19.05mm) | 0.750 (19.05mm) | - | 0.375 (9.52mm) | - | 10.00°C/W @ 200 LFM | 24.00°C/W | Aluminum | |
|
110991327HEAT SINK KIT FOR RASPBERRY PI 4 Seeed Technology Co., Ltd |
6,985 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Top Mount Kit | Adhesive | - | - | - | - | - | - | - | - | Aluminum | |
|
506007B00000GHEATSINK TO-3 LOW PROFILE .375 Aavid, Thermal Division of Boyd Corporation |
5,124 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Board Level | Bolt On | Rectangular, Fins | 2.000 (50.80mm) | 1.750 (44.45mm) | - | 0.375 (9.52mm) | 10.0W @ 70°C | 3.00°C/W @ 400 LFM | 7.00°C/W | Aluminum | |
|
ATS-PCB1024HEATSINK TO-220 BLACK Advanced Thermal Solutions Inc. |
2,695 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level | Bolt On | Rectangular, Fins | 1.180 (29.97mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | - | 11.00°C/W @ 200 LFM | 16.70°C/W | Aluminum | |
|
658-25ABHEATSINK CPU 28MM SQ BLK Wakefield-Vette |
6,332 | - |
RFQ |
Ficha técnica |
Bulk | 658 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.100 (27.94mm) | 1.100 (27.94mm) | - | 0.250 (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | - | Aluminum |
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