Térmico - Disipadores de calor

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
CE-OMNI-38

CE-OMNI-38

HEATSINK CER TO-220 TO-247

Wakefield-Vette
380 -

RFQ

CE-OMNI-38

Ficha técnica

Tray - Active Board Level, Vertical Solderable Feet Rectangular, Fins 0.803 (20.40mm) 1.339 (34.00mm) - 1.512 (38.40mm) - 3.80°C/W @ 200 LFM 7.00°C/W Ceramic
OMNI-UNI-40-50-D

OMNI-UNI-40-50-D

HEATSINK TO-247 TO-264 TO-220

Wakefield-Vette
282 -

RFQ

OMNI-UNI-40-50-D

Ficha técnica

Bulk OmniKlip™ Active Board Level, Vertical Clip, Solder Foot Rectangular, Fins 1.969 (50.00mm) 1.575 (40.00mm) - 2.953 (75.00mm) - - - Aluminum
609-50ABS3

609-50ABS3

HEATSINK FOR POWERPC CPU BLK

Wakefield-Vette
464 -

RFQ

609-50ABS3

Ficha técnica

Bulk 609 Active Top Mount Clip, Thermal Material Rectangular, Pin Fins 2.895 (73.53mm) 2.000 (50.80mm) - 0.500 (12.70mm) - 2.50°C/W @ 250 LFM - Aluminum
904-27-2-23-2-B-0

904-27-2-23-2-B-0

HEATSINK 27X27X23MM PIN

Wakefield-Vette
1,181 -

RFQ

904-27-2-23-2-B-0

Ficha técnica

Box 904 Active Top Mount Push Pin Square, Pin Fins 1.063 (27.00mm) 1.063 (27.00mm) - 0.892 (22.65mm) - 3.20°C/W @ 200 LFM 10.60°C/W Aluminum
904-27-1-23-2-B-0

904-27-1-23-2-B-0

HEATSINK 27X27X23MM ELLIPTICAL

Wakefield-Vette
117 -

RFQ

904-27-1-23-2-B-0

Ficha técnica

Box 904 Active Top Mount Push Pin Square, Pin Fins 1.063 (27.00mm) 1.063 (27.00mm) - 0.892 (22.65mm) - 3.50°C/W @ 200 LFM 9.40°C/W Aluminum
908-35-1-12-2-B-0

908-35-1-12-2-B-0

HEATSINK 35X35X12MM ELLIPTICAL

Wakefield-Vette
404 -

RFQ

908-35-1-12-2-B-0

Ficha técnica

Box 908 Active Top Mount Push Pin Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.457 (11.60mm) - 3.10°C/W @ 200 LFM 11.10°C/W Aluminum
906-31-1-23-2-B-0

906-31-1-23-2-B-0

HEATSINK 31X31X23MM ELLIPTICAL

Wakefield-Vette
303 -

RFQ

906-31-1-23-2-B-0

Ficha técnica

Box 906 Active Top Mount Push Pin Square, Pin Fins 1.220 (30.99mm) 1.220 (30.99mm) - 0.892 (22.65mm) - 2.50°C/W @ 200 LFM 8.90°C/W Aluminum
906-31-1-12-2-B-0

906-31-1-12-2-B-0

HEATSINK 31X31X12MM ELLIPTICAL

Wakefield-Vette
287 -

RFQ

906-31-1-12-2-B-0

Ficha técnica

Box 906 Active Top Mount Push Pin Square, Pin Fins 1.220 (30.99mm) 1.220 (30.99mm) - 0.457 (11.60mm) - 3.50°C/W @ 200 LFM 10.70°C/W Aluminum
906-31-2-23-2-B-0

906-31-2-23-2-B-0

HEATSINK 31X31X23MM PIN

Wakefield-Vette
262 -

RFQ

906-31-2-23-2-B-0

Ficha técnica

Box 906 Active Top Mount Push Pin Square, Pin Fins 1.220 (30.99mm) 1.220 (30.99mm) - 0.892 (22.65mm) - 2.40°C/W @ 200 LFM 9.90°C/W Aluminum
OMNI-220-18-50-2C

OMNI-220-18-50-2C

HEATSINK 18X50MM 2-CLIP TO-220

Wakefield-Vette
211 -

RFQ

OMNI-220-18-50-2C

Ficha técnica

Tray OmniKlip™ Active Board Level, Vertical Clip, Solder Foot Rectangular, Fins 1.969 (50.00mm) 0.710 (18.03mm) - 1.500 (38.10mm) - - - Aluminum
908-35-2-12-2-B-0

908-35-2-12-2-B-0

HEATSINK 35X35X12MM PIN

Wakefield-Vette
472 -

RFQ

908-35-2-12-2-B-0

Ficha técnica

Box 908 Active Top Mount Push Pin Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.457 (11.60mm) - 3.10°C/W @ 200 LFM 11.10°C/W Aluminum
908-35-2-23-2-B-0

908-35-2-23-2-B-0

HEATSINK 35X35X23MM PIN

Wakefield-Vette
166 -

RFQ

908-35-2-23-2-B-0

Ficha técnica

Tray 908 Active Top Mount Push Pin Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.892 (22.65mm) - 2.10°C/W @ 200 LFM 8.80°C/W Aluminum
910-40-2-12-2-B-0

910-40-2-12-2-B-0

HEATSINK 40X40X12MM PIN

Wakefield-Vette
772 -

RFQ

910-40-2-12-2-B-0

Ficha técnica

Box 910 Active Top Mount Push Pin Square, Pin Fins 1.575 (40.00mm) 1.575 (40.00mm) - 0.457 (11.60mm) - 2.80°C/W @ 200 LFM 9.20°C/W Aluminum
OMNI-UNI-30-75-D

OMNI-UNI-30-75-D

HEATSINK TO-247 TO-264 TO-220

Wakefield-Vette
3,574 -

RFQ

OMNI-UNI-30-75-D

Ficha técnica

Bulk OmniKlip™ Active Board Level, Vertical Clip, Solder Foot Rectangular, Fins 2.953 (75.00mm) 1.181 (30.00mm) - 2.362 (60.00mm) - - - Aluminum
OMNI-220-18-75-3C

OMNI-220-18-75-3C

HEATSINK 18X75MM 3-CLIP TO-220

Wakefield-Vette
2,182 -

RFQ

OMNI-220-18-75-3C

Ficha técnica

Tray OmniKlip™ Active Board Level, Vertical Clip, Solder Foot Rectangular, Fins 2.953 (75.00mm) 0.710 (18.03mm) - 1.500 (38.10mm) - - - Aluminum
127695

127695

2.22 WIDE X 12 DC/DC HEATSINK

Wakefield-Vette
179 -

RFQ

127695

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 12.000 (304.80mm) 2.220 (56.39mm) - 0.410 (10.42mm) - - 1.75°C/W Aluminum
125331

125331

2.4WX12 EXTRUSION 12613

Wakefield-Vette
105 -

RFQ

125331

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 12.000 (304.80mm) 2.400 (60.96mm) - 0.900 (22.86mm) - - 1.03°C/W Aluminum
127745

127745

2.22 WIDE X 36 DC/DC HEATSINK

Wakefield-Vette
3,117 -

RFQ

127745

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 36.000 (914.40mm) 2.222 (56.44mm) - 0.410 (10.42mm) - - 1.75°C/W Aluminum
395-1AB

395-1AB

HEATSINK 3X5X2.5 POWER/IGBT

Wakefield-Vette
175 -

RFQ

395-1AB

Ficha técnica

Bulk 395 Active Board Level Bolt On Rectangular, Fins 3.000 (76.20mm) 5.000 (127.00mm) - 2.500 (63.50mm) - 0.50°C/W @ 500 LFM 1.10°C/W Aluminum
127684

127684

9.333 WIDE X 12 FLATBACK HEATS

Wakefield-Vette
183 -

RFQ

127684

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 12.000 (304.80mm) 9.333 (237.06mm) - 0.905 (23.00mm) - - 0.26°C/W Aluminum
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15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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