Térmico - Disipadores de calor

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
901-19-2-23-2-B-0

901-19-2-23-2-B-0

HEATSINK 19X19X23MM PIN

Wakefield-Vette
504 -

RFQ

901-19-2-23-2-B-0

Ficha técnica

Box 901 Active Top Mount Push Pin Square, Pin Fins 0.748 (19.00mm) 0.748 (19.00mm) - 0.892 (22.65mm) - 5.40°C/W @ 200 LFM 10.60°C/W Aluminum
OMNI-UNI-18-50

OMNI-UNI-18-50

HEATSINK 18X50MM TO-247 TO-264

Wakefield-Vette
350 -

RFQ

OMNI-UNI-18-50

Ficha técnica

Tray OmniKlip™ Active Board Level, Vertical Clip, Solder Foot Rectangular, Fins 1.969 (50.00mm) 0.710 (18.03mm) - 1.500 (38.10mm) - - - Aluminum
902-21-2-12-2-B-0

902-21-2-12-2-B-0

HEATSINK 21X21X12MM PIN

Wakefield-Vette
5,535 -

RFQ

902-21-2-12-2-B-0

Ficha técnica

Box 902 Active Top Mount Push Pin Square, Pin Fins 0.827 (21.00mm) 0.827 (21.00mm) - 0.457 (11.60mm) - 5.80°C/W @ 200 LFM 14.30°C/W Aluminum
902-21-2-23-2-B-0

902-21-2-23-2-B-0

HEATSINK 21X21X23MM PIN

Wakefield-Vette
117 -

RFQ

902-21-2-23-2-B-0

Ficha técnica

Box 902 Active Top Mount Push Pin Square, Pin Fins 0.827 (21.00mm) 0.827 (21.00mm) - 0.892 (22.65mm) - 4.30°C/W @ 200 LFM 11.60°C/W Aluminum
904-27-2-12-2-B-0

904-27-2-12-2-B-0

HEATSINK 27X27X12MM PIN

Wakefield-Vette
1,060 -

RFQ

904-27-2-12-2-B-0

Ficha técnica

Box 904 Active Top Mount Push Pin Square, Pin Fins 1.063 (27.00mm) 1.063 (27.00mm) - 0.457 (11.60mm) - 4.30°C/W @ 200 LFM 12.90°C/W Aluminum
904-27-1-12-2-B-0

904-27-1-12-2-B-0

HEATSINK 27X27X12MM ELLIPTICAL

Wakefield-Vette
367 -

RFQ

904-27-1-12-2-B-0

Ficha técnica

Box 904 Active Top Mount Push Pin Square, Pin Fins 1.063 (27.00mm) 1.063 (27.00mm) - 0.457 (11.60mm) - 4.80°C/W @ 200 LFM 11.40°C/W Aluminum
OMNI-UNI-34-75

OMNI-UNI-34-75

HEATSINK TO-247 TO-264 TO-220

Wakefield-Vette
208 -

RFQ

OMNI-UNI-34-75

Ficha técnica

Bulk OmniKlip™ Active Board Level, Vertical Clip, Solder Foot Rectangular, Fins 2.953 (75.00mm) 1.339 (34.00mm) - 2.953 (75.00mm) - - - Aluminum
OMNI-UNI-40-75-D

OMNI-UNI-40-75-D

HEATSINK TO-247 TO-264 TO-220

Wakefield-Vette
2,909 -

RFQ

OMNI-UNI-40-75-D

Ficha técnica

Bulk OmniKlip™ Active Board Level, Vertical Clip, Solder Foot Rectangular, Fins 2.953 (75.00mm) 1.575 (40.00mm) - 2.953 (75.00mm) - - - Aluminum
641A

641A

HEATSINK TO-3 PWR HORZ MT BLK

Wakefield-Vette
363 -

RFQ

641A

Ficha técnica

Bulk 641 Active Board Level Bolt On Rectangular, Angled Fins 3.000 (76.20mm) 4.125 (104.77mm) - 1.000 (25.40mm) 15.0W @ 36°C 0.90°C/W @ 250 LFM 2.40°C/W Aluminum
641K

641K

HEATSINK TO-3 HORZ MT NO HOLES

Wakefield-Vette
326 -

RFQ

641K

Ficha técnica

Bulk 641 Active Board Level Press Fit Rectangular, Angled Fins 3.000 (76.20mm) 4.125 (104.77mm) - 1.000 (25.40mm) 15.0W @ 36°C 0.90°C/W @ 250 LFM 2.40°C/W Aluminum
OMNI-UNI-18-75

OMNI-UNI-18-75

HEATSINK 18X75MM TO-247 TO-264

Wakefield-Vette
837 -

RFQ

OMNI-UNI-18-75

Ficha técnica

Tray OmniKlip™ Active Board Level, Vertical Clip, Solder Foot Rectangular, Fins 2.953 (75.00mm) 0.710 (18.03mm) - 1.500 (38.10mm) - - - Aluminum
401A

401A

HEATSINK POWER TO-3 BLK

Wakefield-Vette
299 -

RFQ

401A

Ficha técnica

Bulk 401 Active Board Level Bolt On Rectangular, Fins 1.500 (38.10mm) 4.750 (120.65mm) - 1.250 (31.75mm) 30.0W @ 80°C 1.50°C/W @ 250 LFM 2.60°C/W Aluminum
401K

401K

HEATSINK POWER NO MNT HOLES BLK

Wakefield-Vette
142 -

RFQ

401K

Ficha técnica

Bulk 401 Active Board Level Press Fit Rectangular, Fins 1.500 (38.10mm) 4.750 (120.65mm) - 1.250 (31.75mm) 30.0W @ 80°C 1.50°C/W @ 250 LFM 3.00°C/W Aluminum
680-125A

680-125A

HEATSINK POWER TO-3 BLK

Wakefield-Vette
489 -

RFQ

680-125A

Ficha técnica

Bulk 680 Active Board Level Bolt On Square, Pin Fins 1.810 (45.97mm) 1.810 (45.97mm) - 1.250 (31.75mm) 7.5W @ 45°C 1.50°C/W @ 400 LFM 6.00°C/W Aluminum
OMNI-UNI-41-75

OMNI-UNI-41-75

UNIVERSAL TO HEATSINK 41X75MM

Wakefield-Vette
1,014 -

RFQ

OMNI-UNI-41-75

Ficha técnica

Tray OmniKlip™ Active Board Level, Vertical Clip, Solder Foot Rectangular, Fins 2.953 (75.00mm) 1.614 (41.00mm) - 2.480 (62.99mm) - - - Aluminum
421K

421K

HEATSINK POWER NO MNT HOLES BLK

Wakefield-Vette
1,097 -

RFQ

421K

Ficha técnica

Bulk 421 Active Board Level Press Fit Rectangular, Fins 3.000 (76.20mm) 4.750 (120.65mm) - 2.625 (66.67mm) 50.0W @ 58°C 0.70°C/W @ 250 LFM 1.16°C/W Aluminum
125313

125313

2.875WX12 EXTRUSIO 16078 XX2013

Wakefield-Vette
102 -

RFQ

125313

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 12.000 (304.80mm) 2.875 (73.03mm) - 1.312 (33.32mm) - - 0.58°C/W Aluminum
122551

122551

HEATSINK EXTRUSION 12.32

Wakefield-Vette
282 -

RFQ

122551

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 12.320 (312.93mm) 3.420 (86.87mm) - 1.630 (41.40mm) - 30.00°C/W @ 200 LFM 0.95°C/W Aluminum
395-2AB

395-2AB

HEATSINK 5.5X5X2.5 POWER/IGBT

Wakefield-Vette
103 -

RFQ

395-2AB

Ficha técnica

Bulk 395 Active Board Level, Extrusion Bolt On Rectangular, Fins 5.500 (139.70mm) 5.000 (127.00mm) - 2.500 (63.50mm) - 0.30°C/W @ 500 LFM 0.90°C/W Aluminum
125296

125296

1.625WX36 EXTRUSIO 16079 XX2014

Wakefield-Vette
361 -

RFQ

125296

Ficha técnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 36.000 (914.40mm) 1.625 (41.28mm) - 1.312 (33.32mm) - - 0.80°C/W Aluminum
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1500+ Promedio diario de RFQ
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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