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Térmico - Disipadores de calor

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	PackageCooled	AttachmentMethod	Shape	Length	Width	Diameter	FinHeight	PowerDissipation@TemperatureRise	ThermalResistance@ForcedAirFlow	ThermalResistance@Natural
303MM HEATSINK COMPACT Wakefield-Vette	2,095	-	RFQ	Ficha técnica	Bulk	303	Active	Board Level, Vertical	Press Fit	Rectangular, Fins	2.000 (50.80mm)	3.000 (76.20mm)	-	2.000 (50.80mm)	15.0W @ 37°C	1.30°C/W @ 250 LFM	-	Aluminum Alloy
413F HEATSINK POWER TO-3 Wakefield-Vette	3,409	-	RFQ	Ficha técnica	Bulk	413	Active	Board Level, Extrusion	Press Fit	Rectangular, Fins	3.000 (76.20mm)	4.750 (120.65mm)	-	2.625 (66.67mm)	50.0W @ 72°C	0.85°C/W @ 250 LFM	-	Aluminum
26176CTE HEATSINK SMT PKG Wakefield-Vette	2,758	-	RFQ	Ficha técnica	Bulk	261	Active	Board Level	Clip	Rectangular, Fins	0.763 (19.38mm)	1.000 (25.40mm)	-	0.450 (11.43mm)	-	-	11.00°C/W	Copper
490-35K HEATSINK KING SIZE HIGH PWR RECT Wakefield-Vette	3,565	-	RFQ	Ficha técnica	Bulk	490	Active	Board Level, Extrusion	Press Fit	Rectangular, Fins	3.500 (88.90mm)	9.520 (241.81mm)	-	6.750 (171.45mm)	200.0W @ 84°C	0.18°C/W @ 600 LFM	-	Aluminum
641V HEATSINK FOR METAL CASE SEMI Wakefield-Vette	3,552	-	RFQ		Bulk	641	Active	Board Level	Bolt On	Rectangular, Angled Fins	4.125 (104.78mm)	3.000 (76.20mm)	-	1.000 (25.40mm)	15.0W @ 36°C	0.90°C/W @ 250 LFM	-	Aluminum
650-B HEATSINK FOR DIPS Wakefield-Vette	3,064	-	RFQ	Ficha técnica	Bulk	650	Active	Top Mount	Thermal Tape, Adhesive (Not Included)	Rectangular, Fins	0.250 (6.35mm)	0.740 (18.80mm)	-	0.240 (6.10mm)	0.5W @ 40°C	4.00°C/W @ 300 LFM	-	Aluminum
125565 6.818WX11.81 EXTRUSION 19333-12 Wakefield-Vette	3,325	-	RFQ	Ficha técnica	Box	-	Obsolete	Top Mount, Extrusion	Adhesive	Rectangular, Fins	12.000 (304.80mm)	4.429 (112.50mm)	-	3.500 (88.90mm)	-	-	0.09°C/W	Aluminum