+86 075582561136
Subir BOM
Soldadura
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD2036SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
3,800 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.018 (0.46mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMD2032SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
2,578 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.016 (0.40mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMD2028SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
3,337 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.014 (0.36mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMD2020SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
3,489 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.010 (0.25mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMD2016SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
3,954 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008 (0.20mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
GA100-10GGALLIUM METAL 99.99% PURE 10G IN Chip Quik Inc. |
2,941 | - |
RFQ |
Ficha técnica |
Bulk | CHIPQUIK® | Active | Solder Paste | Ga100 | - | 85.57°F (29.76°C) | - | - | - | - | Syringe, 0.35 oz (9.922g) | - | - |
|
SMD3SWLT.047 2OZSOLDER WIRE SN42/BI58 .047 2OZ Chip Quik Inc. |
3,979 | - |
RFQ |
Ficha técnica |
Bulk | SMD3 | Active | Wire Solder | Bi58Sn42 (58/42) | 0.047 (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 2 oz (56.70g) | - | - |
|
NC191LTA500T5CSMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3,323 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 5 | - | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
NC191LTA35T5SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3,442 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 5 | - | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
CQ100GEGERMANIUM DOPED SUPER LOW DROSS Chip Quik Inc. |
2,955 | - |
RFQ |
Ficha técnica |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | - | 441°F (227°C) | - | - | - | Lead Free | Bar, 1 lb (454g) | - | - |
|
SMDBI100-S-16SOLDER SHOT BI100 16OZ 454G Chip Quik Inc. |
3,006 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Solder Shot | Bi100(100) | - | 521°F (271°C) | - | - | - | Lead Free | Bag, 1 lb (454g) | - | - |
|
NC191LTA250SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3,882 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 4 | - | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
SMD2215SOLDER SPHERES 63/37 .030 DIAM Chip Quik Inc. |
2,525 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.030 (0.76mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMD2205SOLDER SPHERES 63/37 .025 DIAM Chip Quik Inc. |
3,385 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.025 (0.64mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMD291AX500T3SOLDER PASTE SN63/PB37 500G Chip Quik Inc. |
3,148 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
SMD2190SOLDER SPHERES 63/37 .020 DIAM Chip Quik Inc. |
3,586 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMD2165SOLDER SPHERES 63/37 .012 DIAM Chip Quik Inc. |
3,420 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.012 (0.31mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMD4300AX500T3CSOLDER PASTE 63/37 T3 500G Chip Quik Inc. |
2,447 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
TS991AX500T4SOLDER PASTE THERMALLY STABLE NC Chip Quik Inc. |
3,975 | - |
RFQ |
Ficha técnica |
Bulk | CHIPQUIK® | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
SMD291SNL500T3SOLDER PASTE SAC305 500G Chip Quik Inc. |
2,743 | - |
RFQ |
Ficha técnica |
Jar | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
