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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
643647-1CONN SOCKET SIP 15POS TIN TE Connectivity AMP Connectors |
3,064 | - |
RFQ |
Ficha técnica |
Tray | Diplomate DL | Obsolete | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
643650-1CONN SOCKET SIP 18POS TIN TE Connectivity AMP Connectors |
2,954 | - |
RFQ |
Ficha técnica |
Tray | Diplomate DL | Obsolete | SIP | 18 (1 x 18) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
643652-1CONN SOCKET SIP 20POS TIN TE Connectivity AMP Connectors |
3,579 | - |
RFQ |
Ficha técnica |
Tray | Diplomate DL | Obsolete | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
643652-3CONN SOCKET SIP 20POS TIN TE Connectivity AMP Connectors |
3,033 | - |
RFQ |
Ficha técnica |
Tray | Diplomate DL | Obsolete | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
643652-6CONN SOCKET SIP 20POS TIN TE Connectivity AMP Connectors |
2,429 | - |
RFQ |
Ficha técnica |
Tray | Diplomate DL | Obsolete | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
643657-1CONN SOCKET SIP 25POS TIN TE Connectivity AMP Connectors |
3,046 | - |
RFQ |
Ficha técnica |
Tray,Box | Diplomate DL | Obsolete | SIP | 25 (1 x 25) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
643640-1CONN SOCKET SIP 8POS TIN TE Connectivity AMP Connectors |
3,051 | - |
RFQ |
Ficha técnica |
Tray | Diplomate DL | Obsolete | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
643642-1CONN SOCKET SIP 10POS TIN TE Connectivity AMP Connectors |
3,527 | - |
RFQ |
Ficha técnica |
Tray | Diplomate DL | Obsolete | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
821949-5CONN SOCKET PQFP 132POS TIN-LEAD TE Connectivity AMP Connectors |
2,482 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | QFP | 132 (4 x 33) | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
|
821949-4CONN SOCKET PQFP 100POS TIN-LEAD TE Connectivity AMP Connectors |
3,831 | - |
RFQ |
Ficha técnica |
Tube,Tube | - | Obsolete | QFP | 100 (4 x 25) | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
|
822114-4CONN SOCKET PQFP 160POS TIN-LEAD TE Connectivity AMP Connectors |
3,707 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | QFP | 160 (4 x 40) | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
|
2-382189-1CONN IC DIP SOCKET 32POS TIN TE Connectivity AMP Connectors |
3,042 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic |
|
|
2-644018-2CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
2,089 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic |
|
2-641932-4CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
3,319 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic |
|
2-641933-1CONN IC DIP SOCKET 24POS TIN TE Connectivity AMP Connectors |
2,329 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic |
|
|
2-644018-4CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
3,685 | - |
RFQ |
Ficha técnica |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic |
|
2-641932-2CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
3,442 | - |
RFQ |
Ficha técnica |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic |
|
2-641615-3CONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors |
2,153 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-641261-1CONN IC DIP SOCKET 14POS TIN TE Connectivity AMP Connectors |
2,437 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641260-1CONN IC DIP SOCKET 8POS TIN TE Connectivity AMP Connectors |
3,729 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
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