Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
111-93-636-41-001000

111-93-636-41-001000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.
2,441 -

RFQ

111-93-636-41-001000

Ficha técnica

Tube 111 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-636-41-001000

111-43-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,397 -

RFQ

111-43-636-41-001000

Ficha técnica

Tube 111 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-640-41-605000

110-93-640-41-605000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
2,661 -

RFQ

110-93-640-41-605000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-640-41-605000

110-43-640-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,116 -

RFQ

110-43-640-41-605000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-432-41-001000

116-47-432-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
2,597 -

RFQ

116-47-432-41-001000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-632-41-001000

116-47-632-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
2,638 -

RFQ

116-47-632-41-001000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-650-41-006000

116-41-650-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,398 -

RFQ

116-41-650-41-006000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-650-41-006000

116-91-650-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,077 -

RFQ

116-91-650-41-006000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-322-31-002000

614-43-322-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,188 -

RFQ

614-43-322-31-002000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-422-31-002000

614-43-422-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,711 -

RFQ

614-43-422-31-002000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-322-31-002000

614-93-322-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,991 -

RFQ

614-93-322-31-002000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-422-31-002000

614-93-422-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,821 -

RFQ

614-93-422-31-002000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-93-316-41-003000

127-93-316-41-003000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.
3,133 -

RFQ

127-93-316-41-003000

Ficha técnica

Tube 127 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-43-316-41-003000

127-43-316-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,202 -

RFQ

127-43-316-41-003000

Ficha técnica

Tube 127 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-324-41-780000

104-11-324-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,612 -

RFQ

104-11-324-41-780000

Ficha técnica

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-424-41-780000

104-11-424-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,453 -

RFQ

104-11-424-41-780000

Ficha técnica

Tube 104 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-624-41-780000

104-11-624-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,429 -

RFQ

104-11-624-41-780000

Ficha técnica

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-47-764-41-005000

117-47-764-41-005000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.
3,788 -

RFQ

117-47-764-41-005000

Ficha técnica

Tube 117 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-47-664-41-005000

117-47-664-41-005000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,650 -

RFQ

117-47-664-41-005000

Ficha técnica

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-650-41-003000

115-91-650-41-003000

SOCKET IC OPEN LOWPRO .600 50POS

Mill-Max Manufacturing Corp.
2,889 -

RFQ

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic
Total 12145 Record«Prev1... 140141142143144145146147...608Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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