Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
210-11-640-41-001000

210-11-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,227 -

RFQ

210-11-640-41-001000

Ficha técnica

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-47-964-41-001000

111-47-964-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,265 -

RFQ

111-47-964-41-001000

Ficha técnica

Tube 111 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-322-41-001000

116-41-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,644 -

RFQ

116-41-322-41-001000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-422-41-001000

116-41-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,424 -

RFQ

116-41-422-41-001000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-322-41-001000

116-91-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,191 -

RFQ

116-91-322-41-001000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-422-41-001000

116-91-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,681 -

RFQ

116-91-422-41-001000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-424-31-012000

614-93-424-31-012000

SOCKET CARRIER LOWPRO .400 24POS

Mill-Max Manufacturing Corp.
3,830 -

RFQ

614-93-424-31-012000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-424-31-012000

614-43-424-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,110 -

RFQ

614-43-424-31-012000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-47-964-41-001000

210-47-964-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,060 -

RFQ

210-47-964-41-001000

Ficha técnica

Tube 210 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-650-41-001000

110-93-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
2,970 -

RFQ

110-93-650-41-001000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-650-41-001000

110-43-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,671 -

RFQ

110-43-650-41-001000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-636-31-018000

614-41-636-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,444 -

RFQ

614-41-636-31-018000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-636-31-018000

614-91-636-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,208 -

RFQ

614-91-636-31-018000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-41-316-41-002000

124-41-316-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,709 -

RFQ

124-41-316-41-002000

Ficha técnica

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-91-316-41-002000

124-91-316-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,921 -

RFQ

124-91-316-41-002000

Ficha técnica

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-432-41-770000

104-13-432-41-770000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
2,476 -

RFQ

104-13-432-41-770000

Ficha técnica

Tube 104 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
104-13-632-41-770000

104-13-632-41-770000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
2,616 -

RFQ

104-13-632-41-770000

Ficha técnica

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
114-41-952-41-117000

114-41-952-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,403 -

RFQ

114-41-952-41-117000

Ficha técnica

Tube 114 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-952-41-117000

114-91-952-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,621 -

RFQ

114-91-952-41-117000

Ficha técnica

Tube 114 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-430-41-105000

117-43-430-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,895 -

RFQ

117-43-430-41-105000

Ficha técnica

Tube 117 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 142143144145146147148149...608Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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