Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-93-642-41-006000

116-93-642-41-006000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.
2,478 -

RFQ

116-93-642-41-006000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-642-41-006000

116-43-642-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,197 -

RFQ

116-43-642-41-006000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-41-642-41-005000

117-41-642-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,550 -

RFQ

117-41-642-41-005000

Ficha técnica

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-422-41-003000

612-41-422-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,161 -

RFQ

612-41-422-41-003000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-322-41-003000

612-91-322-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,153 -

RFQ

612-91-322-41-003000

Ficha técnica

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-422-41-003000

612-91-422-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,284 -

RFQ

612-91-422-41-003000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-328-41-007000

116-41-328-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,959 -

RFQ

116-41-328-41-007000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-320-41-004000

612-41-320-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,944 -

RFQ

612-41-320-41-004000

Ficha técnica

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-420-41-004000

612-41-420-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,841 -

RFQ

612-41-420-41-004000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-320-41-004000

612-91-320-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,375 -

RFQ

612-91-320-41-004000

Ficha técnica

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-420-41-004000

612-91-420-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,351 -

RFQ

612-91-420-41-004000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-420-41-001000

126-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
3,629 -

RFQ

126-93-420-41-001000

Ficha técnica

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-320-41-001000

126-43-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,092 -

RFQ

126-43-320-41-001000

Ficha técnica

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-420-41-001000

126-43-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,572 -

RFQ

126-43-420-41-001000

Ficha técnica

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-648-41-105000

110-47-648-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,586 -

RFQ

110-47-648-41-105000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-41-640-41-012000

146-41-640-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.
2,212 -

RFQ

146-41-640-41-012000

Ficha técnica

Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-91-640-41-012000

146-91-640-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.
2,301 -

RFQ

146-91-640-41-012000

Ficha técnica

Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-318-41-780000

104-13-318-41-780000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.
2,870 -

RFQ

104-13-318-41-780000

Ficha técnica

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
114-41-950-41-117000

114-41-950-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,118 -

RFQ

114-41-950-41-117000

Ficha técnica

Tube 114 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-950-41-117000

114-91-950-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,187 -

RFQ

114-91-950-41-117000

Ficha técnica

Tube 114 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 137138139140141142143144...608Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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