Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
127-93-620-41-002000

127-93-620-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,654 -

RFQ

127-93-620-41-002000

Ficha técnica

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-93-322-11-480000

605-93-322-11-480000

SOCKET CARRIER LOWPRO .300 22POS

Mill-Max Manufacturing Corp.
2,244 -

RFQ

605-93-322-11-480000

Ficha técnica

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-93-422-11-480000

605-93-422-11-480000

SOCKET CARRIER LOWPRO .400 22POS

Mill-Max Manufacturing Corp.
2,257 -

RFQ

605-93-422-11-480000

Ficha técnica

Tube 605 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-322-11-480000

605-43-322-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
2,553 -

RFQ

605-43-322-11-480000

Ficha técnica

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-422-11-480000

605-43-422-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
3,994 -

RFQ

605-43-422-11-480000

Ficha técnica

Tube 605 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
322-93-132-41-001000

322-93-132-41-001000

SOCKET 2 LEVEL WRAPOST SIP 32POS

Mill-Max Manufacturing Corp.
2,312 -

RFQ

322-93-132-41-001000

Ficha técnica

Tube 322 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-316-41-002000

126-41-316-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,578 -

RFQ

126-41-316-41-002000

Ficha técnica

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-316-41-002000

126-91-316-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,956 -

RFQ

126-91-316-41-002000

Ficha técnica

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-41-620-41-003000

127-41-620-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,346 -

RFQ

127-41-620-41-003000

Ficha técnica

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-91-620-41-003000

127-91-620-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,603 -

RFQ

127-91-620-41-003000

Ficha técnica

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-159-31-018000

714-43-159-31-018000

CONN SOCKET SIP 59POS GOLD

Mill-Max Manufacturing Corp.
2,977 -

RFQ

714-43-159-31-018000

Ficha técnica

Bulk 714 Active SIP 59 (1 x 59) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-648-41-003000

115-91-648-41-003000

SOCKET IC OPEN LOWPRO .600 48POS

Mill-Max Manufacturing Corp.
3,075 -

RFQ

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic
115-41-648-41-003000

115-41-648-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,445 -

RFQ

115-41-648-41-003000

Ficha técnica

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-642-41-001000

115-93-642-41-001000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.
2,999 -

RFQ

115-93-642-41-001000

Ficha técnica

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-642-41-001000

115-43-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,661 -

RFQ

115-43-642-41-001000

Ficha técnica

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-964-41-105000

110-47-964-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,309 -

RFQ

110-47-964-41-105000

Ficha técnica

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-11-636-41-001000

110-11-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,561 -

RFQ

110-11-636-41-001000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-636-41-770000

104-11-636-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,876 -

RFQ

104-11-636-41-770000

Ficha técnica

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-432-31-018000

614-93-432-31-018000

SOCKET CARRIER LOWPRO .400 32POS

Mill-Max Manufacturing Corp.
2,699 -

RFQ

614-93-432-31-018000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-632-31-018000

614-93-632-31-018000

SOCKET CARRIER LOWPRO .600 32POS

Mill-Max Manufacturing Corp.
3,867 -

RFQ

614-93-632-31-018000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 134135136137138139140141...608Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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