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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ICS-308-TIC SOCKET, DIP, 8P 2.54MM PITCH Adam Tech |
17,355 | - |
RFQ |
Ficha técnica |
Tube | ICS | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ED14DTCONN IC DIP SOCKET 14POS TIN On Shore Technology Inc. |
10,734 | - |
RFQ |
Ficha técnica |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
A 08-LC-TRCONN IC DIP SOCKET 8POS TIN Assmann WSW Components |
6,129 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
ICS-314-TIC SOCKET, DIP, 14P 2.54MM PITCH Adam Tech |
4,669 | - |
RFQ |
Ficha técnica |
Tube | ICS | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ED08DTCONN IC DIP SOCKET 8POS TIN On Shore Technology Inc. |
20,498 | - |
RFQ |
Ficha técnica |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICS-318-TIC SOCKET, DIP, 18P 2.54MM PITCH Adam Tech |
651 | - |
RFQ |
Ficha técnica |
Tube | ICS | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ED18DTCONN IC DIP SOCKET 18POS TIN On Shore Technology Inc. |
5,808 | - |
RFQ |
Ficha técnica |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
AR 06-HZL-TTCONN IC DIP SOCKET 6POS TIN Assmann WSW Components |
22,228 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
ED06DTCONN IC DIP SOCKET 6POS TIN On Shore Technology Inc. |
1,491 | - |
RFQ |
Ficha técnica |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICS-320-TIC SOCKET, DIP, 20P 2.54MM PITCH Adam Tech |
3,595 | - |
RFQ |
Ficha técnica |
Tube | ICS | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
1-2199298-1CONN IC DIP SOCKET 6POS TIN TE Connectivity AMP Connectors |
20,188 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
ED16DTCONN IC DIP SOCKET 16POS TIN On Shore Technology Inc. |
10,129 | - |
RFQ |
Ficha técnica |
Tube | ED | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICS-324-TIC SOCKET, DIP, 24P 2.54MM PITCH Adam Tech |
3,975 | - |
RFQ |
Ficha técnica |
Tube | ICS | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICS-328-TIC SOCKET, DIP, 28P 2.54MM PITCH Adam Tech |
11,368 | - |
RFQ |
Ficha técnica |
Tube | ICS | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
A 14-LC-TTCONN IC DIP SOCKET 14POS TIN Assmann WSW Components |
64,199 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
A 14-LC-TRCONN IC DIP SOCKET 14POS TIN Assmann WSW Components |
2,011 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
1-2199298-2CONN IC DIP SOCKET 8POS TIN TE Connectivity AMP Connectors |
8,365 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
1-2199298-3CONN IC DIP SOCKET 14POS TIN TE Connectivity AMP Connectors |
2,379 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
ED24DTCONN IC DIP SOCKET 24POS TIN On Shore Technology Inc. |
5,374 | - |
RFQ |
Ficha técnica |
Tube | ED | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
A 16-LC-TRCONN IC DIP SOCKET 16POS TIN Assmann WSW Components |
4,759 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
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