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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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110-43-308-41-001000CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp. |
1,939 | - |
RFQ |
Ficha técnica |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
110-93-308-41-001000CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp. |
3,254 | - |
RFQ |
Ficha técnica |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
214-44-308-01-670800CONN IC DIP SOCKET 8POS TIN Mill-Max Manufacturing Corp. |
92,009 | - |
RFQ |
Ficha técnica |
Tube | 214 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-44-318-41-001000CONN IC DIP SOCKET 18POS TIN Mill-Max Manufacturing Corp. |
5,817 | - |
RFQ |
Ficha técnica |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
A-CCS 032-Z-SMIC PLCC SOCKET 32POS TIN SMD Assmann WSW Components |
17,558 | - |
RFQ |
Ficha técnica |
Tube | - | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyamide (PA9T), Nylon 9T, Glass Filled |
|
08-0518-10CONN SOCKET SIP 8POS GOLD Aries Electronics |
6,393 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
8432-21B1-RK-TRCONN SOCKET PLCC 32POS TIN 3M |
17,368 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | 8400 | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
110-13-308-41-001000CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp. |
8,086 | - |
RFQ |
Ficha técnica |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-43-314-41-001000CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp. |
3,103 | - |
RFQ |
Ficha técnica |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
A-CCS 044-Z-TCONN SOCKET PLCC 44POS TIN Assmann WSW Components |
13,834 | - |
RFQ |
Ficha técnica |
Tube | - | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
214-44-314-01-670800CONN IC DIP SOCKET 14POS TIN Mill-Max Manufacturing Corp. |
11,397 | - |
RFQ |
Ficha técnica |
Tube | 214 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
08-3518-00CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
4,711 | - |
RFQ |
Ficha técnica |
Tube | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
110-93-316-41-001000CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp. |
6,693 | - |
RFQ |
Ficha técnica |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
110-43-316-41-001000CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp. |
4,597 | - |
RFQ |
Ficha técnica |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
8444-21B1-RK-TRCONN SOCKET PLCC 44POS TIN 3M |
29,289 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | 8400 | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
110-43-210-10-002000CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp. |
4,999 | - |
RFQ |
Ficha técnica |
Tube | 110 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5), 8 Loaded | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
940-44-032-17-400000CONN SOCKET PLCC 32POS TIN Mill-Max Manufacturing Corp. |
5,481 | - |
RFQ |
Ficha técnica |
Tube | 940 | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
8444-11B1-RK-TPCONN SOCKET PLCC 44POS TIN 3M |
10,621 | - |
RFQ |
Ficha técnica |
Tube | 8400 | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
110-13-314-41-001000CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp. |
3,541 | - |
RFQ |
Ficha técnica |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
940-44-044-17-400000CONN SOCKET PLCC 44POS TIN Mill-Max Manufacturing Corp. |
6,217 | - |
RFQ |
Ficha técnica |
Tube | 940 | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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