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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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TDU03DTONCONN SOCKET TRANSIST 3POS GOLD Sullins Connector Solutions |
893 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Transistor | 3 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Board Guide | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
214-3339-00-0602JCONN IC DIP SOCKET ZIF 14POS GLD 3M |
189 | - |
RFQ |
Ficha técnica |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
224-1275-00-0602JCONN IC DIP SOCKET ZIF 24POS GLD 3M |
2,825 | - |
RFQ |
Ficha técnica |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
1-2324271-3RIGHT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors |
5,113 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
|
1-2324271-4LEFT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors |
4,833 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
220-3342-00-0602JCONN IC DIP SOCKET ZIF 20POS GLD 3M |
2,032 | - |
RFQ |
Ficha técnica |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
208-7391-55-1902CONN SOCKET SOIC 8POS GOLD 3M |
325 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SOIC | 8 (2 x 4) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
2-2129710-5CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors |
654 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic |
|
2-2129710-6CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors |
1,188 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic |
|
248-1282-00-0602JCONN IC DIP SOCKET ZIF 48POS GLD 3M |
181 | - |
RFQ |
Ficha técnica |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
216-7224-55-1902CONN SOCKET SOIC 16POS GOLD 3M |
345 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SOIC | 16 (2 x 8) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
203-2737-55-1102CONN TRANSIST TO-3/TO-66 3POS 3M |
295 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | Transistor, TO-3 and TO-66 | 3 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.234 (5.94mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
210-2599-00-0602CONN SOCKET SIP ZIF 10POS GOLD 3M |
210 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SIP, ZIF (ZIP) | 10 (1 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
220-2600-00-0602CONN SOCKET SIP ZIF 20POS GOLD 3M |
496 | - |
RFQ |
Ficha técnica |
Bulk | Textool™ | Active | SIP, ZIF (ZIP) | 20 (1 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
169-PRS13001-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
135 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
225-PRS15001-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
127 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | 225 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
289-PRS17001-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,350 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
361-PRS19001-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,657 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
441-PRS21001-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,081 | - |
RFQ |
Ficha técnica |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
ICS-306-TIC SOCKET, DIP, 6P 2.54MM PITCH Adam Tech |
9,260 | - |
RFQ |
Ficha técnica |
Tube | ICS | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
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